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Elevator Multi Layered PCB Board / Custom Printed Circuit Boards 2 Layer - 10 Layers

Place of Origin: Zhejiang

Company Profile

Location: Shenzhen, Guangdong, China (Mainland)
Business Type: Manufacturer
Main Products: Multilayer PCB, Fr4 PCB, High Frequency PCB

Product Detail

Model No.: XCEM

Product Description

Elevator PCB Multilayer 8L Circuit Board With High Quality Production

 

 

Specification:

 

Origin: China

Min line space: 3mil

Min line width: 3 mil
Board size: 6*6 cm

Layer: 8

Model: XCEM

Board thickness: 1.2mm

Copper foil: 35UM

Material: FR4

 

 

Parameter:

 

Annual stock meterial Rogers,Taconic,Arton,Isola,F4B,TP-2,FR4,High TG,Halogen free
Layer No. 1-16
Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness toleranceT≥0.8mm±8%,T0.8mm±5%
Wall hole copper thickness 0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)
NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance 1012Ωnormal
Through-hole resistance 300Ωnormal
Electric strength 1.3kv/mm
Current breakdown 10A
Peel strength 1.4N/mm
Soldmask regidity 6H
Thermal stress 28820Sec
Testing voltage 50-300v
Min buried blind via 0.2mm(8mil)
Outer cooper thickness 1oz-5oz
Inner cooper thickness 1/2 oz-4oz
Aspect ratio 8:1
SMT min green oil width 0.08mm
Min green oil open window 0.05mm
Insulation layer thickness 0.075mm-5mm
Aperture 0.2mm-0.6mm
Special technology Inpedance,blind buried via,thick gold,aluminumPCB
Surface finish HASL,lead free,Immersion gold,immersion tin,immersion silver,ENIG,Blue glue,gold plating

 

 

 

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