High Density Interconnect (HDI) Boards

CTE is a China based manufacturer of High Density Interconnect PCBs (HDI PCBs). Our HDI capabilities include laser microvias, blind and buried vias, fine lines and spaces, sequential lamination, via-in-pad technology. We have provided microelectronic pcbs with fine pitch devices down to 200 microns, using 50 micron laser drilled via-in-pad technology and thin build-up materials. Upload your data and receive a free consultation and review of your HDI design today or contact us if you need any design help.

·Via-in-Pad 

·Fine pitch down to 0.25mm  .Sequential lamination

·Stacked microvia  

·Controlled etching capability  up to 10layers

·Staggered Microvia 

·Precise layer to layer registration