ISO9001 Rigid Flexible PCB Design Gold Finger Finish With Aluminum Shielding
| Place of Origin: | Zhejiang |
|---|
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
| Main Products: | Printed Circuit Board Assembly, Prototype PCB Assembly, Turnkey PCB Assembly |
Product Detail
| Model No.: | Flexible printed circuit-9 |
|---|
Product Description
ISO9001 Rigid Flexible PCB Design Gold Finger Finish With Aluminum Shielding
Quick Details
|
PCB Type: |
Flexible Printed Circuit |
|
Layer : |
2 layer |
|
Min .Line Width/Space: |
3mil/3mil |
|
Min. Via Diameter: |
0.3mm |
|
Finish Thickness: |
0.1mm |
|
Surface Finish: |
ENIG |
|
Size: |
60*100MM |
|
Material: |
PI |
|
Color: |
Gold |
|
Application: |
Mobile |
Description
Shenzhen Hengda Electronics is a leading manufacturer of precision Flexible Printed Circuit (FPC) for customers worldwide. We specialize in quick-turn FPC prototypes to FPC mass productions, provide high quality and cost effective turn key solutions to our customers.
This table lists the standard flex circuits materials and material thicknesses that we may have daily available. If the material or thickness you require is not listed, consult us. We have full specification of each material available for your required.
FPC Materials
|
Material Function |
Material Type |
Options |
|
Flexible Insulator |
Polyimide(PI) |
1/2 mil to 5 mil |
|
Conductor |
Copper |
1/4 oz(0.009mm) to 10 oz(0.356mm) |
|
Rigid Substrate (Rigid-Flex) |
FR-4 |
3 mil to 125 mil |
|
Adhesive |
Acrylic Adhesive |
1/2 mil to 3 mil |
|
Adhesiveless Material also available |
||
|
Stiffener |
FR-4 Polyimide(PI) Polyester(PET) Adhesivetape Steel/Aluminum/Copper |
3mil to 125 mil 1/2 mil to 5mil 1 mil to 15mil 6 mil |
|
Solder Mask |
Polyimide(PI) Photoimageable Coverlay Liquid Photoimageable Covercoat |
1/2 mil to 5 mil 1 mil to 2.5 mil Liquid Typically for surface mount and dense applications |
|
Surface Finish Options |
Tin |
Immersion Tin |
|
Gold |
Electrolytic Nickel Immersion Gold Electrolytic Hard Nickel /Gold Electrolytic Soft Nickel/Gold |
|
|
Silver |
Immersion Silver |
|
|
OSP |
OSP |
|
|
Shielding |
Solid Copper Crosshatched Copper Conductive Silver Aluminum |
Required To Limited Electromagnetic and/or Electrostatic |
FPC Standard Structure
Technical Capabilities
|
Layer (Max) |
Up to 8 Layers |
|
|
Board Size (Max) |
500*1000mm |
|
|
Outer tolerance |
a+/-0.2mm Hand Trim |
|
|
Hole |
Diameter(Min) |
0.1mm(Finished) |
|
|
Diameter Tolerance |
a.Plating Through Holes+/-0.08mm b.Non-Plating Through Holes+/-0.05mm |
|
|
Drill Position Tolerance |
+/-0.076mm |
|
Conductor |
Width Tolerance |
+/-15% |
|
Spacing(Min) |
2mil |
|
|
Spacing Tolerance |
+/-15% |
|
|
Pad |
Pad(Non-Wiring) |
>=0.04mm+ Hole |
|
Pad(Wiring) |
>=0.3mm+Hole |
|
|
Coverlay |
Coverlay to Pad(Min) |
|