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SDH MSPP Access Device

1.0 USD
Supply Ability: 10000
Place of Origin: Jiangsu

Company Profile

Location: Changzhou, Jiangsu, China (Mainland)
Business Type: Manufacturer
Main Products: Optic Fiber Closure, Fiber Optic Closure, Optical Splice Closure, Splice Closure, Cables Enclosures

Product Detail

Brand Name: VeeCOM
Specification: y
Production Capacity: 10000
Packing: carton
Delivery Date: 5 days
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Product Description

SDH/MSPP Access Device(MetroEdge-Express) DHODT-LMFIT
Detailed Product Description
As a key member of VeeCOM "MetroEdge-Express"SDH/MSPP Product family, DHODT-LMFIT is a carrier-class, cost-effective, compact (only 1U high) SDH/MSPP platform that is designed for applications in metro and access networks to facilitate the efficient transport of traditional TDM and emerging data traffic for service providers.
DHODT-LMFIT is a modularized unit with 4 universal slots, supporting different interface cards, such as STM-1 fiber optic cards, E1 cards, Ethernet cards (EoS VCAT), and V.35 card. The main board cross-connect capacity is 504*504 VC-12s (8*8 VC-4s), allowing non-blocking adding/dropping services among different interfaces. It supports the hybrid transmission of SDH, PDH, Ethernet and N??4K V.35 services within the same equipment. With the large capacity cross-connect matrix, the DHODT-LMFIT can be configured as ADM, TM, and REG. It is suitable for multiple network topologies such as point-to-point, chain, ring, hub, and mesh networks.
Features:
1.         4 General Slots, supporting a range of interface cards, including SDH, PDH, Ethernet and V.35 cards.
2.         Ethernet service supporting GFP encapsulation, VC12 virtual concatenation (1~63 VC12)
3.         Large cross-connect matrix capacity is 504*504 VC-12s (8*8 VC-4s) and powerful networking ability
4.         LCD display for system configuration and alarm
5.         Inter-working with popular SDH/MSPP products of various vendors
6.         Suitable for 3G access network transmission
7.         Easy commissioning and maintenance
8.         High integration, compact design
9.         High reliability, low CAPEX and OPEX
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