FR4 1.6MM HASL Single Sided PCB Board Green Solder Mask PCB 1OZ
| Place of Origin: | Zhejiang |
|---|
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
| Main Products: | Quick Turn PCB Prototypes, Single Sided PCB, Double Sided PCB |
Product Detail
| Model No.: | base on customer spec. |
|---|
Product Description
FR4 1.6MM HASL Single Sided PCB Board Green Solder Mask PCB 1OZ
|
|
Product Description |
|
Model Number: |
CTE-001 |
|
Number of Layer: |
1layer |
|
Material: |
FR4 |
|
Finish Thickness: |
1.6mm |
|
Finish copper: |
1OZ |
|
Surface Finish: |
HASL |
|
|
Green solder mask |
|
|
White silkscreen |
|
|
CNC routing |
|
Place of Origin: |
China |
|
Brand Name: |
CHITUN |
|
Certification: |
UL,ROHS,ISO |
|
Standard: |
IPC or base on customers' requestion |
CTE Leading the Printed Circuit Board Industry
With over 15years of experience, Chi Tun Electronics LTD is rapidly becoming the logical choice for PCB manufacturers in China. We're proud to manufacture high-quality products. We can handle production orders on 1 layers all the up to 24 layers. and we have quick turn , Small volume and large volume service type without MOQ.
Technology Capability
|
Feature |
2015 |
2016 |
2017 |
|
|
Base Material |
CEM1,CEM3, Aluminum base material |
CEM1,CEM3, Aluminum base material |
CEM1,CEM3, Aluminum base material |
|
|
Max. Layer Count |
24 |
30 |
32 |
|
|
Max. PCB Size (max.) |
558mm X 660mm |
558mm X 660mm |
558mm X 660mm |
|
|
Base copper |
1/3 oz - - 5 oz |
1/3 - - 5 oz |
1/3 - - 5 oz |
|
|
Copper thickness (outer) |
6 oz |
6 oz |
6 oz |
|
|
Max. Board Thickness mm (mil) |
3.4 (134) |
3.4 (134) |
3.4 (134) |
|
|
Min. Board Thickness mm (mil) |
0.1 (4) |
0.1 (4) |
0.1 (4) |
|
|
Min. Line Width / Spacing |
Inner um (mil) |
75/100 (3 4) |
75/75 (3/3) |
75/75 (3/3) |
|
Outer um (mil) |
100/100 (4/4) |
75/75 (3/3) |
75/75 (3/3) |
|
|
Min. Mechanical Drill Size (mm) |
0.2 |
0.2 |
0.2 |
|
|
Min. HWTC um (mil) |
175 (7) |
175 (7) |
175 (7) |
|
|
Min. Soldermask Opening um (mil) |
50 (2) |
50 (2) |
50 (2) |
|
|
Finest SMT Pitch mm (mil) |
0.40 (16) |
0.45 (18) |
0.45 (18) |
|
|
BGA Device Pitch (Base Copper 1oz) (mil) |
0.25-0.3 (10-12) |
0.25-0.3 (10-12) |
0.25-0.3 (10-12) |
|
|
Type of Surface Finish |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
|
|
Impedance Control |
+/- 10% |
+/- 8% |
+/- 8% |
|
|
Warpage |
0.7% |
You Might Also Like | ||
