10 Layer FR4 3.0mm Plating Gold Impedance Control Quick Turn PCB Prototypes HDI PCB
| Place of Origin: | Zhejiang |
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Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
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| Business Type: | Manufacturer |
| Main Products: | Quick Turn PCB Prototypes, Single Sided PCB, Double Sided PCB |
Product Description
10 Layer FR4 3.0mm Plating Gold Impedance Control Quick Turn PCB Prototypes HDI PCB
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Product Description |
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Model Number: |
CTE-008 |
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Number of Layer: |
10layer |
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Material: |
FR4 Tg170 |
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Finish Thickness: |
3.0mm |
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Finish copper: |
2OZ |
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Surface Finish: |
Plating gold |
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Green solder mask |
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White silkscreen |
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CNC routing V-CUT |
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Place of Origin: |
China |
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Brand Name: |
CHITUN |
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Certification: |
UL,ROHS,ISO |
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Standard: |
IPC or base on customers' requestion |
24Hours for urgent 1-2layers ,
2-4days for multilayer PCBs .
24 hour turnaround time on double-sided PCB’s,
2-4 day turn available up to ten layers;
over ten layers can be done in one week.
To shorten the cycle time of new product introduction.
Applications(Target Market):
Cooling and Washing machine, Switching Power Amplifiers, Home Computer, Home Theater/Stereo Surround Sound System, Cable Television Converter Box, Hand Held Video Games, Digital and analog Switching, Remote control electronic toys, Disk Drive duplication systems, LOJACK auto recovery system, Electronic Television Audience Measurement Systems/Electronic Audience Measurement Systems,Headphone Systems ect.
Technology Capability
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Feature |
2015 |
2016 |
2017 |
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Base Material |
CEM1,CEM3, Aluminum base material |
CEM1,CEM3, Aluminum base material |
CEM1,CEM3, Aluminum base material |
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Max. Layer Count |
24 |
30 |
32 |
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Max. PCB Size (max.) |
558mm X 660mm |
558mm X 660mm |
558mm X 660mm |
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Base copper |
1/3 oz - - 5 oz |
1/3 - - 5 oz |
1/3 - - 5 oz |
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Copper thickness (outer) |
6 oz |
6 oz |
6 oz |
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Max. Board Thickness mm (mil) |
3.4 (134) |
3.4 (134) |
3.4 (134) |
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Min. Board Thickness mm (mil) |
0.1 (4) |
0.1 (4) |
0.1 (4) |
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Min. Line Width / Spacing |
Inner um (mil) |
75/100 (3 4) |
75/75 (3/3) |
75/75 (3/3) |
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Outer um (mil) |
100/100 (4/4) |
75/75 (3/3) |
75/75 (3/3) |
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Min. Mechanical Drill Size (mm) |
0.2 |
0.2 |
0.2 |
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Min. HWTC um (mil) |
175 (7) |
175 (7) |
175 (7) |
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Min. Soldermask Opening um (mil) |
50 (2) |
50 (2) |
50 (2) |
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Finest SMT Pitch mm (mil) |
0.40 (16) |
0.45 (18) |
0.45 (18) |
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BGA Device Pitch (Base Copper 1oz) (mil) |
0.25-0.3 (10-12) |
0.25-0.3 (10-12) |
0.25-0.3 (10-12) |
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Type of Surface Finish |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
HASL, lead free HASL, ENIG, Flash gold, Thick gold, Selective gold plating, OSP, Selective OSP /HASL, Immersion Tin, Immersion Silver |
HASL, lead free&nb
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