High Tg 180 FR4 Power Supplier Multi Layer PCB Green Solder Mask

PCB DESCRIPTION

 Material

 FR4 High Tg-180

 Board Thickness

 2.0 mm

 Layer Count

 4-Layer

 Copper Thickness

 2.0 oz

 Surface Finish

 Immerssion Tin

 Solder Mask

 Green

 Silkscreen

 White

 Trace Spacing

 0.030/0.030mm

 Hole Size

 0.25mm

 Hole Copper Thickness

 ≥20μm

 Measurement

 64×42mm

 Packing

 Outer: Cardboard Cartons with double straps

 Inner: Vacuum-packed in soft plastic bales  

 Certificates

 HALOGEN-FREE,UL,ISO9001:2008,ROHS,REACH,SGS

 Advantage

 OEM&ODM,Competitive Price,Fast Delivery,Free Samples,

 Special Requirements

 Buried And Blind Via, Impedance Control, Via Plug, 
 BGA Soldering And Gold Finger Are Acceptable

 Applications

 Communication,automobile,cell,computer,medical

 CAPABILITY OF PCB PRINTED CIRCUIT BOARD

 Engineering Process

 Items

 Production Capability

 Laminate Board

 Board Thickness

 0.23.2mm

 Product Type

 Layers

 2L-16L

 Cut Lamination

 Max. Working Panel size

 1000×1200mm

 Layers Inside

 Core Thickness inside

 0.12.0mm

 Internal spacing

 Min: 4/4mil

 Internal Copper Thickness

 1.0~3.0oz

 Tolerance

 Board Thickness Tolerance  

 ±10%

 Inter layer Alignment

 ±3mil

 Drilling

 Panel Measurement

 Max: 660×600mm

 Drilling Dimension

 0.25mm

 Hole Diameter Tolerance

 ±0.05mm

 Hole Position Tolerance

 ±0.076mm

 Min.Annular Ring 

 0.05mm

 PTH+Panel Plating

 Hole Wall copper Thickness

 20um

 Uniformity

 90%

 Outer Layer

 Track Width

 Min: 0.08mm

 Track Spacing

 Min: 0.08mm

 Pattern Plating

 Finished Copper Thickness

 1oz3oz

 EING/Flash Gold

 Nickel Thickness