Multilayer ENIG Surface Finish Custom PCB Boards for Communication

 PRODUCT’S DETAILS

 Raw Material

 FR-4 (Tg 180 available)

 Layer Count

 8-Layer

 Board Thickness

 1.6mm

 Copper Thickness

 2.0oz

 Surface Finish

 ENIG(Electroless Nickel Immersion Gold)

 Solder Mask

 Green

 Silkscreen

 White

 Min. Trace Width/Spacing

 0.075/0.075mm

 Min. Hole Size

 0.25mm

 Hole Wall Copper Thickness

 ≥20μm

 Measurement

 300×400mm

 Packaging

 Inner: Vacuum-packed in soft plastic bales 
 Outer: Cardboard Cartons with double straps

 Application

 Communication,automobile,cell,computer,medical 

 Advantage

 Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

 Special Requirements

 Buried And Blind Via, Impedance Control, Via Plug, 
 BGA Soldering And Gold Finger Are Acceptable

 Certification

 UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

 PRODUCTION CAPABILITY OF PCB

 Process Engineering

 Items

 Manufacturing Capability

 Laminate

 Thickness

 0.23.2mm

 Production Type

 Layer Count

 2L-16L

 Cut Lamination

 Max. Working Panel size

 1000×1200mm

 Inner Layer

 Internal Core Thickness

 0.12.0mm

 Internal width/spacing

 Min: 4/4mil

 Internal Copper Thickness

 1.0~3.0oz

 Dimension

 Board Thickness Tolerance

 ±10%

 Interlayer Alignment

 ±3mil

 Drilling

 Manufacture Panel Size

 Max: 650×560mm

 Drilling Diameter

 0.25mm

 Hole Diameter Tolerance

 ±0.05mm

 Hole Position Tolerance

 ±0.076mm

 Min.Annular Ring 

 0.05mm

 PTH+Panel Plating

 Hole Wall copper Thickness

 20um

 Uniformity

 90%

 Outer Layer

 Track Width

 Min: 0.08mm

 Track Spacing

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Multilayer ENIG surface finish Custom PCB Boards for communication

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