| ITEM | Technical capabilities |
| Layers | 1- 20 layers |
| Max Board Size | 610x610mm |
| Min Board Thickness | 2 layers - 8mil (0.2mm) |
| 4 layers - 16mil (0.4mm) |
| 6 layers - 24mil (0.6mm) |
| 8 layers - 32mil (0.8mm) |
| 10 layers - 40mil (1.0mm) |
| Max Board Thickness | 280mil (7mm) |
| Min Line Width | 3 mil (0.075mm) |
| Min Line Space | 3 mil (0.075mm) |
| Min Hole Size | 6 mil (0.15mm) |
| PTH dia tolerance | +/- 2mil (0.05mm) |
| NPTH hole dia tolerance | ﹢/﹣1mil (0.025mm) |
| Hole Position Deviation | ﹢/-2mil (0.05mm) |
| Outline Tolerance | +/- 4mil (0.1mm) |
| S/M Pitch | 3mil (0.075mm) |
| Aspect ratio (AR) | 1;12 |
| Finished Copper Thickness | 12 oz |
| Profiling | Punching, Routing, V-CUT, Beveling |
| Impedance Control | +/- 5% |
| Insulation Resistance | 1E+12Ω(Normal) |
| Thermal Shock | 3*288Sec |
| Warp and Twist | <= 0.7% |
| Electric Strength | > 1.3KV/mm |
| Peel Strength | 1.4N/mm |
| Solder Mask Color | Green/Yellow/Black/White/Red/Blue |
| Solder Mask Abrasion | >= 6H |
| Flammability | 94V-0 |
| Surface Finishing | HASL, LF-HASL, ENIG, Flash Gold, Immersion Tin, Immersion Silver, OSP,Gold Finger, Peelable Mask, Carbon Printing. and selective surface processing |
| Material | FR-4, CEM-1/CEM-3/ROGERS, Taconic, ARLON, BT, Ceramic, Aluminum |
| PCB Packing | Inner packing: Vacuum packing / Plastic bag |
| Outer packing: Standard carton packing |
| Certificate | UL,ISO 9001, SGS.DQS |
| Target Market(s) | Eastern Europe, Hong Kong/ Macao/ Taiwan, Japan & Korea, Latin America, Mainland China, North America, Northern Europe, Oceania, Southeast Asia, Western Europe |
| Payment Terms | T/T, L/C |
| Minimum Order | 20sqm |
| Lead Time Delivery Time | 15 days |
| Sample Available | YES |
| FOB Port | Shenzhen |
| Loading Info | Depend on customer |
| Packing Info | Standard carton with min cardboard on six sides to protect the goods. Vacuum bag + Outer carton |
