OEM communication Copper Clad Copper Clad PCB With High Tg / FR-5 / ROGERS

PRODUCT’S DETAILS

Raw Material

FR-4 (Tg 180 available)

Layer Count

6-Layer

Board Thickness

1.6mm

Copper Thickness

2.0oz

Surface Finish

ENIG(Electroless Nickel Immersion Gold)

Solder Mask

Green

Silkscreen

White

Min. Trace Width/Spacing

0.075/0.075mm

Min. Hole Size

0.25mm

Hole Wall Copper Thickness

≥20μm

Measurement

300×400mm

Packaging

Inner: Vacuum-packed in soft plastic bales

Outer: Cardboard Cartons with double straps

Application

Communication,automobile,cell,computer,medical

Advantage

Competitive Price,Fast Delivery,OEM&ODM,Free Samples,

Special Requirements

Buried And Blind Via, Impedance Control, Via Plug,

BGA Soldering And Gold Finger Are Acceptable

Certification

UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE

PRODUCTION CAPABILITY OF PCB

PROCESS Engineer

ITEMS Item

          PRODUCTION CAPABILITY Manufacturing Capability

Laminate

Type

FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ,

ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON

Thickness

0.23.2mm

Production Type

    Layer Count

2L-16L

Surface Treatment

 HAL,Gold Plating,Immersion Gold,OSP,Immersion Silver,Immersion Tin,Lead