Place of Origin: | Zhejiang |
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Location: | Shaoguan, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | Multi Layer PCB |
Model No.: | SYF-001 |
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FR-4 Tg 180 Customized PCBA Board / SMT / SMD Assembly With ROSH REACH SGS
Key Specifications/Special Features |
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1 |
We SYF have 6 PCB production lines and 4 advanced SMT lines with high speed. |
2 |
All kinds of integrated circuits are accepted,such as SO, SOP, SOJ, TSOP, TSSOP, QFP, DIP, CSP,BGA and U-BGA , Because Our placement precision can reach chip +0.1mm on integrated circuit parts. |
3 |
We SYF can provide service of 0201 chip placement, through-hole components insertion and finished products fabrication, testing and packaging. |
4 |
SMT/SMD assembly and through-hole components insertion |
5 |
IC preprogramming |
6 |
Function verification and burn in testing |
7 |
Complete unit assembly (which including plastics, metal box, coil, cable inside and more) |
8 |
Environmental coating |
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Engineering including end of life components, obsolete component replace and design support for circuit, metal and plastic enclosure |
10 |
Packaging design and production of customized PCBA |
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100% quality assurance |
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High mixed, low volume order is also welcomed. |
13 |
Full component procurement or the substitute components sourcing |
14 |
UL,ISO9001:2008, ROSH ,REACH,SGS,HALOGEN-FREE compliant |
PRODUCTION CAPABILITY OF PCB ASSEMBLY |
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Stencil Size Range |
756 mm x 756 mm |
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Min. IC Pitch |
0.30 mm |
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Max. PCB Size |
560 mm x 650 mm |
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Min. PCB Thickness |
0.30 mm |
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Min. Chip Size |
0201 (0.6 mm X 0.3 mm) |
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Max. BGA Size |
74 mm X 74 mm |
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BGA Ball Pitch |
1.00 mm (Min) / F3.00 mm (Max) |
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