2.0oz Copper FR4 FR1 FR5 PCB Rigid Plate For Computer 1.6mm / 6 Layer PCB
| Place of Origin: | Zhejiang |
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Company Profile
| Location: | Shaoguan, Guangdong, China (Mainland) |
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| Business Type: | Manufacturer |
| Main Products: | Multi Layer PCB |
Product Detail
| Model No.: | SYF-001 |
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Product Description
2.0oz Copper FR4 FR1 FR5 PCB Rigid Plate For Computer 1.6mm / 6 Layer PCB
8 layer FR4 Multilayer PCB with ENIG surface finish,1.6mm board thickness with 2.0oz copper thickness for communication products.
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PRODUCT’S DETAILS |
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Raw Material |
FR-4 (Tg 180 available) |
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Layer Count |
6-Layer |
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Board Thickness |
1.6mm |
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Copper Thickness |
2.0oz |
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Surface Finish |
ENIG(Electroless Nickel Immersion Gold) |
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Solder Mask |
Green |
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Silkscreen |
White |
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Min. Trace Width/Spacing |
0.075/0.075mm |
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Min. Hole Size |
0.25mm |
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Hole Wall Copper Thickness |
≥20μm |
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Measurement |
300×400mm |
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Packaging |
Inner: Vacuum-packed in soft plastic bales |
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Application |
Communication,automobile,cell,computer,medical |
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Advantage |
Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
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Special Requirements |
Buried And Blind Via, Impedance Control, Via Plug, |
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Certification |
UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
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PRODUCTION CAPABILITY OF PCB |
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ITEMS Item |
Capability |
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Laminate |
Type |
FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, |
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Thickness |
0.23.2mm |
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Production Type |
Layer Count |
2L-16L |
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Surface Treatment |
HAL,Gold Plating,Immersion Gold,OSP, Immersion Silver, Immersion Tin,Lead Free&n
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