FR4 Double Side Multi-Layer PCB Board Assembly Immersion Gold Printed Circuit
| Place of Origin: | Zhejiang |
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Company Profile
| Location: | Shaoguan, Guangdong, China (Mainland) |
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| Business Type: | Manufacturer |
| Main Products: | Multi Layer PCB |
Product Detail
| Model No.: | SYF-256 |
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Product Description
FR4 Double Side Multi-Layer Immersion Gold Printed Circuit Board Assembly
| PRODUCT’S DETAILS | |
| Raw Material | FR-4 (Tg 180 available) |
| Layer Count | 4-Layer |
| Board Thickness | 1.0mm |
| Copper Thickness | 2.0oz |
| Surface Finish | ENIG(Electroless Nickel Immersion Gold) |
| Solder Mask | Green |
| Silkscreen | White |
| Min. Trace Width/Spacing | 0.075/0.075mm |
| Min. Hole Size | 0.25mm |
| Hole Wall Copper Thickness | ≥20μm |
| Measurement | 300×400mm |
| Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
| Application | Communication,automobile,cell,computer,medical |
| Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
| Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
| PRODUCTION CAPABILITY OF PCB | ||
PROCESS Engineer |
ITEMS Item | PRODUCTION CAPABILITY Manufacturing Capability |
| Laminate | Type | FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON |
| Thickness | 0.23.2mm | |
| Production Type | Layer Count | 2L-16L |
| Surface Treatment | HAL,Gold Plating,Immersion Gold,OSP, Immersion Silver,Immersion Tin,Lead Free HAL |
|
| Cut Lamination | Max. Working Panel size | 1000×1200mm |
| Inner Layer | Internal Core Thickness | 0.12.0mm |
| Internal width/spacing | Min: 4/4mil | |
| Internal Copper Thickness | 1.0~3.0oz | |
| Dimension | Board Thickness Tolerance | ±10% |
| Interlayer Alignment | ±3mil | |
| Drilling | Manufacture Panel Size | Max: 650×560mm |
| Drilling Diameter | 0.25mm | |
| Hole Diameter Tolerance | ±0.05mm | |
| Hole Position Tolerance | ±0.076mm | |
| Min.Annular Ring | 0.05mm | |
| PTH+Panel Plating | Hole Wall copper Thickness | 20um |
| Uniformity | 90% | |
| Outer Layer | Track Width | Min: 0.08mm |
| Track Spacing | Min: 0.08mm | |
| Pattern Plating | Finished Copper Thickness | 1oz3oz |
| EING/Flash Gold | Nickel Thickness | 2.5um~5.0um |
| Gold Thickness | 0.03~0.05um | |
| Solder Mask | Thickness | 1535um |
| Solder Mask Bridge | 3mil | |
| Legend | Line width/Line spacing | 6/6mil |
| Gold Finger | Nickel Thickness | 120u |
| Gold Thickness | 150u | |
| Hot Air Level | Tin Thickness | 100300u |
| Routing | Tolerance of Dimension | ±0.1mm |
| Slot Size | Min:0.4mm | |
| Cutter Diameter | 0.82.4mm | |
| Punching | Outline Tolerance | ±0.1mm |
| Slot Size | Min:0.5mm | |
| V-CUT | V-CUT Dimension | Min:60mm |
| Angle | 15°30°45° | |
| Remain Thickness Tolerance | ±0.1mm | |
| Beveling | Beveling Dimension | 30300mm |
| Test | Testing Voltage | 250V |
| Max.Dimension | 540×400mm | |
| Impedance Control | Tolerance |
±10% |
| Aspect Ration | 12:1 | |
| Laser Drilling Size | 4mil(0.1mm) | |
| Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering and Gold Finger Are Acceptable |
|
| OEM&ODM Service | Yes | |
Quick Details
- One of the largest PCB(Printed Circuit Board) manufacturers in China with over 500 staff.
- One of the professional PCB manufacturers in China with 20 years’ experience.
- Certifications of ISO9001:2008
