Place of Origin: | Zhejiang |
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Location: | Shaoguan, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | Multi Layer PCB |
Model No.: | SYF-260 |
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4-Layer FR4 ENIG Immersion Gold Custom Printed Circuit Board PCB
PRODUCT’S DETAILS | |
Raw Material | FR-4 |
Layer Count | 4-Layer |
Board Thickness | 1.0mm |
Copper Thickness | 2.0oz |
Surface Finish | ENIG(Electroless Nickel Immersion Gold) |
Solder Mask | Blue |
Silkscreen | White |
Min. Trace Width/Spacing | 0.075/0.075mm |
Min. Hole Size | 0.25mm |
Hole Wall Copper Thickness | ≥20μm |
Measurement | 300×400mm |
Packaging | Inner: Vacuum-packed in soft plastic bales Outer: Cardboard Cartons with double straps |
Application | Communication,automobile,cell,computer,medical |
Advantage | Competitive Price,Fast Delivery,OEM&ODM,Free Samples, |
Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering And Gold Finger Are Acceptable |
Certification | UL,ISO9001:2008,ROHS,REACH,SGS,HALOGEN-FREE |
PRODUCTION CAPABILITY OF PCB | ||
PROCESS Engineer | ITEMS Item | PRODUCTION CAPABILITY Manufacturing Capability |
Laminate | Type | FR-1,FR-5,FR-4 High-Tg,ROGERS,ISOLA,ITEQ, ALUMINUM,CEM-1,CEM-3,TACONIC,ARLON,TEFLON |
Thickness | 0.23.2mm | |
Production Type | Layer Count | 2L-16L |
Surface Treatment | HAL,Gold Plating,Immersion Gold,OSP, Immersion Silver,Immersion Tin,Lead Free HAL | |
Cut Lamination | Max. Working Panel size | 1000×1200mm |
Inner Layer | Internal Core Thickness | 0.12.0mm |
Internal width/spacing | Min: 4/4mil | |
Internal Copper Thickness | 1.0~3.0oz | |
Dimension | Board Thickness Tolerance | ±10% |
Interlayer Alignment | ±3mil | |
Drilling | Manufacture Panel Size | Max: 650×560mm |
Drilling Diameter | 0.25mm | |
Hole Diameter Tolerance | ±0.05mm | |
Hole Position Tolerance | ±0.076mm | |
Min.Annular Ring | 0.05mm | |
PTH+Panel Plating | Hole Wall copper Thickness | 20um |
Uniformity | 90% | |
Outer Layer | Track Width | Min: 0.08mm |
Track Spacing | Min: 0.08mm | |
Pattern Plating | Finished Copper Thickness | 1oz3oz |
EING/Flash Gold | Nickel Thickness | 2.5um~5.0um |
Gold Thickness | 0.03~0.05um | |
Solder Mask | Thickness | 1535um |
Solder Mask Bridge | 3mil | |
Legend | Line width/Line spacing | 6/6mil |
Gold Finger | Nickel Thickness | 120u |
Gold Thickness | 150u | |
Hot Air Level | Tin Thickness | 100300u |
Routing | Tolerance of Dimension | ±0.1mm |
Slot Size | Min:0.4mm | |
Cutter Diameter | 0.82.4mm | |
Punching | Outline Tolerance | ±0.1mm |
Slot Size | Min:0.5mm | |
V-CUT | V-CUT Dimension | Min:60mm |
Angle | 15°30°45° | |
Remain Thickness Tolerance | ±0.1mm | |
Beveling | Beveling Dimension | 30300mm |
Test | Testing Voltage | 250V |
Max.Dimension | 540×400mm | |
Impedance Control | Tolerance | ±10% |
Aspect Ration | 12:1 | |
Laser Drilling Size | 4mil(0.1mm) | |
Special Requirements | Buried And Blind Via, Impedance Control, Via Plug, BGA Soldering and Gold Finger Are Acceptable | |
OEM&ODM Service | Yes |
Quick Details