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Fast produce FPC manufacturer and FPCB and FPC Assembly

0.5~7.0 USD
Min. Order: 1 Piece/Pieces
Trade Term: FOB
Payment Terms: L/C, D/P, D/A, T/T, WU
Supply Ability: 700,000 Square Meter/Square Meters per Month
Place of Origin: Guangdong

Company Profile

Location: Shenzhen, Guangdong, China (Mainland)
Business Type: Manufacturer
Main Products: Pcb

Product Detail

Means of Transport: Ocean, Air
Number of Layers: 10-Layer
Production Capacity: 700,000 Square Meter/Square Meters per Month
Packing: Anti-static bag, bubble pack, carton box,Vacuum..
Delivery Date: 15 days for OEM, 2 days for ready goods
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Product Description

Metal Core PCB

 

Independent research and development of metal substrate production equipment, introduced SF shape processing technology, applied to various light bar, can improve the utilization rate of material free of mold, and improve customer productivity efficiency. Independent research and development of thermal conductivity of soft sheet material and technology can be applied to a variety of modeling of the high power lighting field.

Our COB product Has more than 5 years experience in COB product development and production experience, the only global mirror polishing technology, specular reflectivity reaches as high as 97%, line yield rate as high as 99.9% or more; otherwise the development of a number of COB process and patented technology

Feature

· Improvement in High thermal conductivity using Prepreg

· Upgrade of warp and twist problem caused by Coefficient of thermal expansion 

· Excellent corrosion resistant and durability of abrasion

· Good dimensional stability

Application

· LCD, LED, BLU, Substrate for LED, Power Supply, Converter, Inverter

· Automobile igniter, Automobile Controller, Voltage Regulator Converter, Motor Driver, PDP, Audio etc.

 

 

 

 


Category

Capability

1

Layers

1-2Layer

2

Material Supplier

Bergquist,Laird,Sanyo,Polytronics,TOTKING,DENKA,NRK ITEQ,BOYU

3

Metal base type

FR-4, Al base board, CU base board

4

Aluminum models

1100,3303,5052,6061

5

Board Thickness

0.5-3.2mm

6

Insulation layer thickness

50-150um

7

Max Board Size

1220×500mm

8

 Heat conductivity

1W/Mk, 2W/Mk, 3W/Mk, 4W/Mk, 8W/Mk

9

Electric Strength 

 

DC:600V/50uA or 1000V/5mA(LED)

According to the material properties

AC:2000V/1Ma or 5000V/5mA(POWER)

10

Core material thickness

Min:0.1mm

11

Inner line width/Space

0.1/0.1mm

12

Outer line width/Space

0.15/0.15mm

13

Layer to Layer Registration

±0.05mm

14

Copper foil thickness

HOZ,1OZ,2OZ

15

Finished hole diameter

0.55mm

16

Hole diameter tolerance

±0.05mm

17

Hole position tolerance

±0.075mm

18

Surface finish

HASL,HASL pb free,immersion gold,immersion silver,immersion tin,

O.S.P (Entek),S/G plating,ENEPIG,G/F plating,carbon…

19

Profiling

Punching, Routing, V-CUT, Beveling

20

Special requirements

Buried and blind vias ,controlled impedance ,BGA

21

minimum V-CUT  Board Thickness

0.6mm

 

22

maximum Test Insulation Resistance

 

100MΩ

 

23

minimum Test Conductive Resistance

 

10 Ω

 

24

Plate shape tolerance

 

±0.10mm(4mil)



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