4-layer Mobile Phone Mainboard BGA PCB with EING Surface
| Min. Order: | 1 Piece/Pieces |
|---|---|
| Trade Term: | FOB |
| Payment Terms: | T/T |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
| Main Products: | Pcb, Pcba, Pcb Assembly, Odm/oem |
Product Detail
| Model No.: | SMTPCB0159 |
|---|---|
| Means of Transport: | Ocean, Air |
| electronics: | pcb |
Product Description
4-layer Mobile Phone Mainboard BGA PCB with EING Surface
Specifications:
Base material: PTFE, PCB, FR4
Layer count: 4layer board
Board thickness: 0.8mm
Copper thickness: 1oz
Surface finishing: ENIG
Soldermask color: green
Available specifications:
Base materials: FR4, aluminum, FPC and copper
Copper thickness: 0.5oz (minimum)
Copper thickness: 4oz (minimum)
Board thickness: 0.2mm (minimum)
Board thickness: 3.2mm (maximum)
Surface finishing: HAL, ENIG, OSP, gold finger and tin chemistry
Possible soldermask colors: green, black, white, yellow, blue, red and more
Board dimensions: 600 x 1,000mm
Hole diameter: 0.2mm (minimum)
Line width: 0.075mm (minimum)
Line spacing: 0.075mm (minimum)
SMT pitch: 30° (minimum)
Annular ring: 0.05mm (minimum)
Aspect ratio: 11:01
Surface/hole plating tolerance:
Hole tolerance (PTH): 0.25mm
Hole tolerance (NPTH): 0.15mm
SM tolerance (LPI): Dimension
Electrically test: supported
With RoHS Directive-compliant
Possibility of SMT device mounting: supported