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Good Insulator HPBN Ceramic BN Taper Crucible For Pharmaceutical Industries

1.0 USD
Min. Order: 1 Piece/Pieces
Trade Term: FOB
Payment Terms: T/T
Supply Ability: 10000
Place of Origin: Fujian

Company Profile

Location: Xiamen, Fujian, China (Mainland)
Business Type: Manufacturer

Product Detail

Means of Transport: Ocean, Air
Brand Name: innovacera
Shape: Crucible
Production Capacity: 10000
Packing: By carton
Delivery Date: 30
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Product Description

Good Insulator HPBN Ceramic BN Round Crucible For  Pharmaceutical Industries/Innovacera     

 

 Keywords:  BN Crucible, BN Cylinder Crucible, BN Conical Crucible, BN Taper Crucible, BN conicity crucible,  BN cylinderal crucible, BN round Crucible.

 

 

Product Description

Using the BN crucible,  can use in temperature 1800 degrees C in vacuum condition, not bonded with the metal liquid, non-reactive, thermal shock resistance, resistance to corrosion, coating evenly. Thermal shock cracking, adhesive products, do not contaminate the product.

Hot pressed BN is compacted at temperatures up to 2000°C and pressures up to 2000 psi to form a dense, strong engineering material that is easily machined.  It is available in standard and custom hot pressed shapes and has several unique characteristics and physical properties which make it valuable for solving tough problems in a wide range of industrial applications.

The HPBN Crucible  is widely used For Semiconductor, Electronics, Metallurgical, Thin Film, and Pharmaceutical Industries.

Hot pressed boron nitride shapes are used as critical components in applications where excellent thermal shock resistance, high electrical resistivity and chemical and corrosion resistance is required.

High Temperature Insulators

Molten Metal crucibles and nozzles

High temperature furnace components

Rollers and formers for the glass industry

Thermocouple Tubes

 

 

PropertiesUnitsBoron Nitride (BN)
HPBNPBN
MechanicalDensityg/cm32.2~2.32.1-2.19
Color_whitewhite
Water Absorption%00
Vickers HardnessGpa(Moh's=2)(Knoop=691)
Flexural Strength       (20°C)Mpa100243.63
Compressive Strength           (20°C)Mpa287_
ThermalThermal Conductivity   (20°C)W/m.K3543-60
Thermal Shock Resistance       (20°C)Δ T(C)__
Maximum Use Temperature°C24002200
ElectricalVolume Resistivity       (25°C)Ω.cm10 ^ 8~10 ^ 133.11x10 ^ 11

 

 

Boron Nitride

Technical Boron Nitride Features:

 

1.High thermal conductivity

2.Low thermal expansion

3.Good thermal shock resistance

4.High electrical resistance

5.Low dielectric constant and loss tangent

6.Microwave transparency

7.Non toxic

8.Easily machined - non abrasive and lubricious

9.Chemically inert

10.Not wet by most molten metals

 

 

 

H/PBN Application

Technical Boron Nitride Application:

 

 

1.Electronic Parts - heat sinks, substrates, coil forms, prototypes

 

2.Boron doping wafers in silicon semiconductor processing

 

3.Vacuum melting crucibles

 

4.CVD crucibles

 

5.Microcircuit packaging

 

6.Sputtering targets

 

7.High precision sealing, brazing, and metallizing fixtures

 

8.Microwave tubes

 

9.Horizonatal caster break rings

 

10.Low friction seals

 

11.Plasma arc insulators

 

12.High temperature furnace fixtures and supports

 

 

 

Certifications

 

  

 

 

 

 

 


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