Files |
Gerber, Protel, Powerpcb, Autocad, Cam350, etc |
Material |
FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, FR1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
Layer No. |
1 - 30 Layers |
Board thickness |
0.0075"(0.2mm)-0.125"(3.2mm) |
Board Thickness Tolerance |
±10% |
Copper thickness |
0.5OZ - 4OZ |
Impedance Control |
±10% |
Warpage |
0.075%-1.5% |
Peelable |
0.012"(0.3mm)-0.02’(0.5mm) |
Min Trace Width (a) |
0.005"(0.125mm) |
Min Space Width (b) |
0.005"(0.125mm) |
Min Annular Ring |
0.005"(0.125mm) |
SMD Pitch (a) |
0.012"(0.3mm) |
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) |
0.027"(0.675mm) |
Regesiter torlerance |
0.05mm |
Min Solder Mask Dam (a) |
0.005"(0.125mm) |
Soldermask Clearance (b) |
0.005"(0.125mm) |
Min SMT Pad spacing (c) |
0.004"(0.1mm) |
Solder Mask Thickness |
0.0007"(0.018mm) |
Hole size |
0.01"(0.25mm)-- 0.257"(6.5mm) |
Hole Size Tol (+/-) |
±0.003"(±0.0762mm) |
Aspect Ratio |
6:01 |
Hole Registration |
0.004"(0.1mm) |
HASL |
2.5um |
Lead free HASL |
2.5um |
Immersion Gold |
Nickel 3-7um Au:1-3u'' |
OSP |
0.2-0.5um |
Panel Outline Tol (+/-) |
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