High Purity Tungsten Target sputtering Target

Physical properties 

Color

sliver

Density

19.35g/m³

Melting point

5655

Technical indicators 

purity

99.95%

Relative density

>99.9%

Cut surface flatness

3.2Ra

Tolerance

±0.1mm

grain size

uniform

Material 

Tungsten

Brand

MAT-CN

Origin

Nanchang Jiangxi China

Specifications

Size 1: diameter <360mm thickness> 1 mm (wafer / round table / rod)

Size 2: length <300mm width <300mm thickness> 1mm rectangular / sheet / step-like (splicing)

Size 3: outer diameter <360mm inner diameter> 1mm wall degree> 1 mm length> 1 mm (pipe / ring / rotatable targets)

Size 4 :be customized according to user needs, sample processing, to map processing

Minimum order quantity

≥1pc

Supply capacity

the same batch, the same material, continuous and reliable supply; 100 kg / month min

Delivery time

a single sheet of material 1 week delivery, bulk material 20 days -30 days delivery(working days)

Production process

vacuum levitation melting, casting into ingots, thermo-mechanical treatment and precision machining

Applicable instruments

various models magnetron sputtering equipment, etc.

Product uses

industrial-grade coating, experiments or research level C target electronics, optoelectronics, military, decorative, functional film

Advantages

quality

1. reliability, price

2.restore preparation of high purity, less impurities

3.dense, rolling, oxidation, forming plasticizers

4.relatively high density, grain uniformity axis, consistency

Product accessories

formal quotation / purchase and sales contracts / packing list / material analysis detection of single / formal invoice

Packing vacuum

packaging / vacuum neutral packing / special packaging outside reinforcement package

Mode of transport for

domestic express carrier DHL, FEDEX, EMS, UPS(FOB/CIF)---safe, fast and reliable