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small SMT production line

6399.0~6440.0 USD
Min. Order: 1 Set/Sets
Trade Term: FOB
Payment Terms: moneygram, T/T, WU
Supply Ability: 100sets/week
Place of Origin: Zhejiang

Company Profile

Location: Hangzhou, Zhejiang, China (Mainland)
Business Type: Manufacturer, Trading Company
Main Products: Hot Air Reflow Soldering Machine, SMT Pick And Place Machine, Reflow Oven, Stencil Printer, Desktop Automatic Chip Mounter

Product Detail

Model No.: SMT production line
Means of Transport: Ocean, Air
Brand Name: Neoden
Description: SMT production line
manual printer: yes
automatic placement machine: yes
automatic IR reflow oven: yes
complete cycle time: about 20 min
max capability of placement machine: 7000pcs/h
work power of reflow oven: 4500W
temperage range of reflow oven: room temperature to 380 degree
temperature profiles: 8 predefine temperature profiles
temperature heat model: 5 independent heating zone
Production Capacity: 100sets/week
Packing: Stardard export package
Delivery Date: 3 working days after payment
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Product Description

SMT Production line

Application
This production line meets the needs small medium SMT production and prototype operation.
Procedure
  • Solder PCB waste printing
  • Surface components placement
  • Reflow soldering
Composed by
  1. Stencil Printer: Medium
  2. Pick and place machine: TM240A
  3. IR hot-air reflow ovensmall SMT production line
Model
Manual Solder printer
Medium
automatic
pick and place machine
TM240A
IR reflow solder
T960
Total
Length71cm100cm200cm371cm
Machine Weight13kg35kg90kg138kg
Working power0100W4500W4600W

Production line cost:6520USD
The basic equipment of production line: 1 worker, 10KW power supply
Paremeters of SMT production line
Stencil Printer(medium size)
Work mode: Manual
N.W:13kg
Maximum print Area:320*440mm
Pick and Place Machine TM240A
Work mode: automatic
Function: pick and place SMD components

Paremeters
ModelTM240A
Applicable PCB20mm*20mm~400mm*360mm
Placement head quantity2
Max mounting capability7000PCS/h
Positioning accuracy30um
Applicable Components 0402-5050,SOP, QFN, IC
Components supply configurationTape reel, bulk package (IC)
Tape width8mm, 12mm, 16mm
Feeders  16(8mm=21, 12mm=4, 16mm=2, bulk IC=1)
External Dimension L 980mm×W 655mm×H 285mm
Vacuum pump -92KPA (Mute type pump)
Vacuum pump quantity3 (Built-in)
Power supply220V, 50Hz (Convertible to 110V)
Average working power100W
WeightG.W: 65KG  (N.W: 35KG)
Packing sizeL 112cm×W 81cm×H 48cm
IR Hot-air Reflow Solder Machine T960
Work mode: automatic
Function: reflow solder
Paremters
ModelT-960
Heating zone Qtyupper3/down2
Length of the heating zone960mm
Heating typeintelligent level sirocco and rapid infrared heating
Cooling zone Qty1
Maximum width of PCB board300mm
Operation directionleft→right
Delivery modelNet transmission+chain transmission
Speed of conveyer belt0-1600mm/min
The power supplyThree phase 5 line 380V50/60Hz
Peak power4.5KW
Preheating timeAround 15mins
Temperature control rangeRoom temperature~300°C
Temperature control modePID closed-loop control
Temperature control accuracy±1°C
PCB temperature distribution deviation±2°C
Overall dimensions1450×630×470mm
Machine weight160KGS
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