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HASL GOLD 4 layer pcb with 0.2mm pcb holes OEM & ODM for telecommunication

Place of Origin: Zhejiang

Company Profile

Location: Shenzhen, Guangdong, China (Mainland)
Business Type: Manufacturer, Distributor/Wholesaler
Main Products: Double Sided PCB

Product Description

HASL GOLD 4 layer pcb with 0.2mm pcb holes OEM & ODM for telecommunication

 

Specifications

 
1.Substantially invested in equipments
2.OEM&ODM are welcome
3.Competitive price
4.Quick delivery


 

We are professional PCB manufacturer especially in pcb assembly . We have substantially invested in new equipment, improving processes flow,concentrating quality control and organizational employees training in oder to improve customer services and manufacture quality products. Our accomplishments have been recognized with an issue of UL certificate(UL number E306819).

 

Application

 

Products  pcb assembly are applied to a wide range of Hightech industries such as: LED, telecommunication, computer application, lighting, game machine, industrial control, power, automobile and high-end consumer electronics, ect. By unremitting work and effort to the marketing, products exports to American, Canada, Europe counties, Africa and other Asia-pacific countries.

 

What can we do for you ?

We can provide the products pcb assembly such as 1 to 30 layers,RoHS Compliant, UL-listed,Fine line 0.07mm min,Microvia 0.2mm min,Blind Vias & Buried Vias,Surface as Chemical Tin, Silver, Gold ,HASL,Falsh Gold,HASL lead free,For high current: 3 OZ Copper,Special material: AL Based,Rogers,FR4,FR4 HTG,CEM-1,SMD-stencils,A.O.I. (Automatic Optical Inspection),X-Ray (innerlayer misalignment control),Impedance Control with Testprotocol pcb assembly . 

 

 

Advantage

 

1.Excellent quality and reasonable price .

2.PCB with high quality. strict test through AOI (Automated Optical Inspection),QA/QC, Flying Proble Test, E-test fixture

3.PCB with many years exporting experience as well as  reputable after-sale services.

 

 Our capability as following
 
 
Productivity
Item  Technical standards 
Rise  1-30layer
Material  CEM-1,CEM-3,FR-4,FR4 TG170,TG180 ,HALOGEN FREE
Lamellar  0.2mm-3.20m(8mil-126mil)
Minimum thickness  0.1mm(4mil)
Thick copper 0.5-6 OZ
Min line w / s  0.075mm(3mil)
Min Hole Side  0.20mm(8mil)
Min aperture Chong  0.9mm(35mil)
Tolerance  Hole drilling bit ±0.075mm(3mil)
Linewidth ±0.05mm(2mil)Or width of ± 20%
Aperture PTH±0.075mm(3mil)
NPTH±0.05mm(2mil)
Shape tolerance Milling Machine±0.15mm(6mil)
Punch±0.10mm(4mil)
Warp 0.70%-1.5%
Pad surface treatment Nickel/Gold Finger Plating/Flash Gold /Entek/LEAD Free Hal
Insulation Resistance 10k-20MΩ
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