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Taiwan Entai 0.25mm25Wpcs BGA Solder ball

Min. Order: 10 Piece/Pieces
Payment Terms: T/T, paypal, WU
Supply Ability: 50 pieces per day
Place of Origin: Guangdong

Company Profile

Location: Shenzhen, Guangdong, China (Mainland)
Business Type: Manufacturer, Distributor/Wholesaler
Main Products: Hot Flow BGA Rework Station

Product Detail

Model No.: 0.25mm
Means of Transport: Ocean, Land
Component: Sn63/Pb37
Production Capacity: 50 pieces per day
Delivery Date: 1 week
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Product Description

0.25mm*25W pcs BGA solder ball   
Standard package by manfacturer   
Leaded composition
0.250mm Leaded solder ball
Brand: Taiwan Entai
Producing areaTaiwan
Component: Sn63/Pb37
Solder ball diameter: 0.250mm
Package: Antistatic material, 25Wpcs/bottle
Entai Sicence and Technology CO.,Ltd is one of the solder ball manufacturers authenticated by TS 16949.
Solder ball's diameter can be 75um, there is a few manufacturers which can make that craft.
Sphere diameter's tolerance is the strict, internally piloting tolerance is only 8um, far lower than the standard 10-25um in the industry.
Refining material made by self, strengthen solder ball's welding ability, and increase the rate of welding.
Added microelement increase solder's antioxidant ability and reliability.
Packing material adopts antistatic material and fits ROHS standard.
What is solder ball:
Solder balls mainly connect semiconductor chip and line-moldboard or PCB board, they are the smallest electronic component transmitting electronic signal.




Our company is an internet agency, can supply all the goods constantly and offer all kinds of testing report and certificate. Welcome to wholesale!
Wholesale is at least 1 box24bottles), please consult with customer service about wholesale price.
0.25mm solder ball is generally used to reball on the chip which Video Memory particle is very small and small size.




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