10-layer multilayer HDI pcb
0.1~0.5 USD
| Min. Order: | 5 Piece/Pieces |
|---|---|
| Payment Terms: | Paypal, T/T, WU |
| Supply Ability: | 120000 Square Meter /Month |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
| Main Products: | PCB |
Product Detail
| Model No.: | tws-pll-2013072501 |
|---|---|
| Means of Transport: | Ocean, Air, Land |
| Brand Name: | TWS |
| Base Material: | FR-1,FR-2,FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,Aluminum material |
| Copper Thickness: | 0.5-4.0oz |
| Board Thickness: | 0.2mm-7mm |
| Min. Hole Diameter: | 0.25mm |
| Min. Line Width: | 0.075mm(3mil) |
| Min. Line Spacing: | 0.075mm(3mil) |
| Surface Finishing: | HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
| Layer: | 1-28 Layer |
| Solder Mask: | green/red/blue/white/yellow |
| MAX.Board Size: | 9200*900mm |
| Certification: | UL/SGS/ROHS |
| Controlled impedance: | ±5% |
| Warp&Twist: | 0.7% |
| Rang of finish boards thickness: | 0.21~7.0mm |
| Impedance control: | ±10% |
| OEM/ODM: | One-stop service |
| PCB standard: | IPC-A-610D |
| Production Capacity: | 120000 Square Meter /Month |
| Packing: | vacuum packaging and carton box |
| Delivery Date: | 5-15 working days after your payments |
Product Description
Material:FR4/94vo/CEM-1/CEM-3
Layers: 8L
Thickness:1.6MM
Goldthickness:1 um
Surface finish: Gold plating /commersion gold/HASL/OSP
Surface finish: Gold plating /commersion gold/HASL/OSP
LineWidth/Space: 8mil/8mil
Solder Mask Color: Green
Solder Mask Color: Green
NO | Item | Craft Capacity |
1 | Layer | 1-28 Layers |
2 | Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
3 | Rang of finish baords Thickness | 0.21-7.0mm |
4 | Max size of finish board | 900MM*900MM |
5 | Minimum Linewidth | 3mil (0.075mm) |
6 | Minimum Line space | 3mil (0.075mm) |
7 | Min space between pad to pad | 3mil (0.075mm) |
8 | Minimum hole diameter | 0.10 mm |
9 | Min bonding pad diameter | 10mil |
10 | Max proportion of drilling hole and board thickness | 1:12.5 |
11 | Minimum linewidth of Idents | 4mil |
12 | Min Height of Idents | 25mil |
13 | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
14 | Soldermask | Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. |
15 | Minimun thickness of soldermask | 10um |
16 | Color of silk-screen | White, Black, Yellow ect. |
17 | E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
18 | Other test | ImpedanceTesting,Resistance Testing, Microsection etc., |
19 | Date file format | GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
20 | Special technological requirement | Blind & Buried Vias and High Thickness copper |
21 | Thickness of Copper | 0.5-14oz (18-490um) |
Tks for you looking, hope you have a greatday!
