Min. Order: | 1 Square Meter |
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Trade Term: | FOB |
Payment Terms: | L/C, D/P, D/A, T/T, WU |
Supply Ability: | 1000square meter/per day |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | WRE809 |
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Means of Transport: | Ocean, Air, Land |
Max pane size: | 14"*20" |
Independence tolerance: | +/-10% |
Aspecr Ratio: | 9:1 |
Layer count: | 1-20 |
Solder mask abrasion: | ≥8H |
Gold finger: | Ni: 80~250u", Au: 1~5u" |
Warp and twist: | ≤0.75% |
Via plug: | Max via size: 24mil (0.6mm) |
Peel Strength: | 1.4N/mm |
Certification: | UL/SGS/ROHS |
Production Capacity: | 1000square meter/per day |
Packing: | Inner vacuum and plastic package,outer carton box package |
Delivery Date: | 3~10days |
Place ofOrigin: | Guangdong China (Mainland) | BrandName: | OEM | ModelNumber: | YZX-1033 |
Base Material: | FR4 | Copper Thickness: | 2oz | Board Thickness: | 3.2mm |
Min. Hole Size: | 0.3mm | Min. Line Width: | 5mil | Min. Line Spacing: | 5mil |
Surface Finishing: | ENIG | Hight quanlity pcb board: | Multilayer pcb | Durable board: | PCB with best price |
Electronic Components: | FR4 pcb board | Cem1 pcb board: | Hasl pcb board | key word: | cheap pcb prototype |
color: | green | legen: | white | other technology: | gold finger |
part service: | provide part purchasing service | special service: | layout, produce, assembly |
Packaging Detail: | vacuum for inner packing , carton for outer packing, |
Delivery Detail: | 4-6days |
Specification Inch (mm) | ||
Material | FR-4 / Hi Tg FR-4 / Lead free Materials (RoHS Compliant)/CEM-3/CEM-1/Aluminium | |
Layer No. | 1-30 | |
Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) | |
Board Thickness Tolerance | ±10% | |
Cooper thickness | 1/2OZ-4OZ | |
Impedance Control | ±10% | |
Warpage | 0.075%-1.5% | |
Peelable | 0.012"(0.3mm)-0.02'(0.5mm) | |
Min Trace Width (a) | 0.005"(0.125mm) | |
Min Space Width (b) | 0.005"(0.125mm) | |
Min Annular Ring | 0.005"(0.125mm) | |
SMD Pitch (a) | 0.012"(0.3mm) | |
pcb with green solder mask and LF-FREE surface finishingBGA Pitch(b) | 0.027"(0.675mm) | |
Regesiter torlerance | 0.05mm | |
Min Solder Mask Dam (a) | 0.005"(0.125mm) | |
Soldermask Clearance (b) | 0.005"(0.125mm) | |
Min SMT Pad spacing (c) | 0.004"(0.1mm) | |
Solder Mask Thickness | 0.0007"(0.018mm) | |
Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) | |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) | |
Aspect Ratio | 6:1 | |
Hole Registration | 0.004"(0.1mm) | |
Plating | ||
HASL | 2.5um | |
Lead free HASL | 2.5um | |
Immersion Gold | Nickel3-7umAu:1-3u'' | |
OSP | 0.2-0.5um | |
Outline | ||
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) | |
Beveling | 30°45° | |
V-cut | 15° 30° 45° 60° | |
Certificate | ROHSISO9001:2000TS16949SGSUL |