Min. Order: | 10 Piece/Pieces |
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Trade Term: | FOB |
Supply Ability: | 300000 Square meter/Month |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | TWS-E24Y |
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Brand Name: | tws |
Base Material: | PET/PI |
Copper Thickness: | 35um |
Board Thickness: | 2.3mm |
Min. Hole Size: | 0.2mm |
Min. Line Width: | 2mil |
Min. Line Spacing: | 2mil |
Surface Finishing: | Gold plating |
Solder mask: | Green/Blue/Black/White/Yellow/Red etc |
Max size of finish board: | 9200*900mm |
Certification: | UL/SGS/ROHS |
Controlled impedance: | ±5% |
Warp&Twist: | 0.7% |
Rang of finish boards thickness: | 0.21~7.0mm |
Layer count: | 1~28 |
Impedance control: | ±10% |
OEM/ODM: | One-stop service |
PCB standard: | IPC-A-610D |
Production Capacity: | 300000 Square meter/Month |
Packing: | vacuum package+carton box |
Delivery Date: | 5 days for pcb sample, 15 days for mass pcb order. |
Material | FCCL | Tai-flex,Dupont | / | |
FCCL | Ad PI,Adhesive less PI,Halogen free PI | / | ||
THK of FCCLPI | 0.5,1,2mil | / | ||
Cu THK of FCCL | 0.5,1mil | / | ||
THK of CVL | 0.5,1,2mil | / | ||
PI Stiffener | 3,5mil | / | ||
THK of AD | 25um,40um | / | ||
No-flew pp | Arlon1080 (49N,38N); Dim:18X24Inch | / | ||
FR-4 | 7628/2116/1080 | / | ||
Cooper foil | ED:12,18,35,70;RA:70um | / | ||
AD. | 25um,40um | / | ||
CVL | PI THK:0.5,1,2,3mil | / | ||
Surface Treatment | Plating Gold(Hard gold) | 0.25-0.76um, Plating Gold:>0.76um( ) | / | |
ENIG | Ni thk:3--8um,Gold THK:0.025--0.1um | / | ||
Soft Gold | Ni thk:3--8um, Gold THK:0.025--0.13um | / | ||
Immersion Tin | Tin THK:0.80-1.20um | / | ||
Immersion Silver | Silver THK:0.10-0.30um | / | ||
0SP | Film THK:0.15-0.30um | / | ||
HAL, | Tin THK:2-40um | / | ||
HAL lead free | Tin THK:2-40um | / | ||
Silver slurry |
| / | ||
Selective surface finishing | Flash gold+gold finger,ENIG+OSP,ENIG+GOLD Finger,ENIG+HAL,Flash gold+HASL, Immersion sliver+gold finger, immersion Tin+gold finger,Silver slurry+Plating gold,,OSP+ Plating Gold Finger,Silver slurry+ENIG | / | ||
Product Type | Buried /blind via FPC | Uncross Buried /blind via FPC | / | |
Ladder Fab | Inner-L exposure PTH or dis between Pad to O-L circ≥15MIL | / | ||
Stress AD. | Stress AD W.:2mm;Type :3M | / | ||
Impedance Control | Odd,Difference,tolerance±15% | / | ||
Rigid-flex with bot.&top Flex | Slot W.≥5mm | / | ||
Flex Unclad Fab | without exposed PTH or pad | with exposed PTH & pad | ||
Flex Unclad Fab | without exposed PTH or pad | with exposed PTH & pad | ||
Selective hollow FPC | 1-L:finger length≤5mm;Line W≥10mil; | / |