Min. Order: | 1 Square Meter |
---|---|
Trade Term: | FOB |
Payment Terms: | L/C, D/P, D/A, T/T, WU |
Supply Ability: | 1000square meter/per day |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
---|---|
Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | 098IKO |
---|---|
Means of Transport: | Ocean, Air, Land |
Max pane size: | 14"*20" |
Independence tolerance: | +/-10% |
Aspecr Ratio: | 9:1 |
Layer count: | 1-20 |
Solder mask abrasion: | ≥8H |
Gold finger: | Ni: 80~250u", Au: 1~5u" |
Warp and twist: | ≤0.75% |
Via plug: | Max via size: 24mil (0.6mm) |
Peel Strength: | 1.4N/mm |
Certification: | UL/SGS/ROHS |
Production Capacity: | 1000square meter/per day |
Packing: | Inner vacuum and plastic package,outer carton box package |
Delivery Date: | 3~10days |
Place ofOrigin: | Guangdong China (Mainland) | BrandName: | Huagao (HG) | ModelNumber: | BGA-1 |
Number of Layers: | Multilayer | Base Material: | FR4,CEM-1,CEM-3,Teflon,Rogers,Aluminium,HighTg | Copper Thickness: | 1/3 oz- 6 oz |
Board Thickness: | 0.2 mm - 6.0 mm | Min. Hole Size: | 0.2 mm | Min. Line Width: | 3 mil |
Min. Line Spacing: | 3 mil | Surface Finishing: | HASL,LFHASL,ENIG,Gold Finger,Flash Gold,OSP,Carbon,Peelable Mask | Layer: | 2 - 12 layers |
Solder Mask: | All kinds of Color | Impedance Control: | +/- 10% | Product: | High qualitymultilayer motherboard pcb |
Packaging Detail: | Vaccum packing |
Delivery Detail: | 2-7 days |
Layer | 2-12 layers |
Board thickness | 0.2-6.0 mm |
Laminates type | FR-4, CEM-1, CEM-3, BT Resin, Teflon, PTFE, Rogers, Aluminium,Tg130(150,170,180, 210),Berquist, Thermagon, Alon.Polyclad |
Base copper thickness | Min: 12um (1/3oz) Max: 140um (4oz) for inner layer; 210um (6oz) for outer layer |
Min finished hole size | By mechanical drilling: 0.2mm (0.008") |
Aspect ratio | 8:1 |
Max panel size | Mass production: 540mm × 740m (21.25" × 29.13") Sample: 540mm × 1100mm (21.25" × 43.3") |
Minline width/space | 3 mil/3 mil |
Via hole type | Blind, Burried |
Surface finish | HASL/ Lead Free HASL, Immersion Gold / Silver / Tin, Flash Gold, Hard Gold plating, Selective thick Gold Plating, Gold Finger (Gold thickness up to 3um), Plating Silver, Carbon ink, Peelable mark, OSP |
Solder mask | All kinds of colour, LPI, Dry Film, Min S/M pitch (LPI): 0.1mm |
Impedance Control | Single trace or differential controlled 50, 60, 70, 100, 110, 120, 130 ±10% |
Min bonding pitch | 0.181mm (center to center) |
MinSMT pitch | 0.400mm (center tocenter) |
Min annular ring | 0.025mm |
Outline finish type | CNC Routing; V-Scoring/Cut;Punch |
Tolerances | Min Hole registration tolerance (NPTH) ± 0.025mm Min Hole registration tolerance (PTH) ± 0.075mm Min Pattern registration tolerance ± 0.05mm Min S/M registration tolerance (LPI) ± 0.075mm Scoring Lines ± 0.15mm Board thickness (0.1 -1.0mm ) ±15% Board thickness (1.0 -6.35mm ) ±10% Board Size Routed ± 0.13mm Board Size Scored ± 0.2mm |
Electrical Testing | Voltage: 10V - 250V Continuity: 10 - 1000 Ohms |