Min. Order: | 1 Square Meter |
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Trade Term: | FOB |
Payment Terms: | L/C, D/P, D/A, T/T, WU |
Supply Ability: | 1000square meter/per day |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | 8987MN |
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Means of Transport: | Ocean, Air, Land |
Max pane size: | 14"*20" |
Independence tolerance: | +/-10% |
Aspecr Ratio: | 9:1 |
Layer count: | 1-20 |
Solder mask abrasion: | ≥8H |
Gold finger: | Ni: 80~250u", Au: 1~5u" |
Warp and twist: | ≤0.75% |
Via plug: | Max via size: 24mil (0.6mm) |
Peel Strength: | 1.4N/mm |
Certification: | UL/SGS/ROHS |
Production Capacity: | 1000square meter/per day |
Packing: | Inner vacuum and plastic package,outer carton box package |
Delivery Date: | 3~10days |
Place ofOrigin: | Guangdong China (Mainland) | BrandName: | DCH | ModelNumber: | PCB028 |
Number of Layers: | 10-Layer | Base Material: | FR-4, CEM-3 | Copper Thickness: | 18um-105um |
Board Thickness: | 0.2-3.2mm | Min. Hole Size: | 0.2mm | Min. Line Width: | 0.1mm |
Min. Line Spacing: | 0.1mm | Surface Finishing: | lead free hasl | Certification: | UL, ROHS, ISO9001:2000 |
Color: | Green,Blue,Black,Red,Yellow etc. | Soldermask: | Green |
NO | ITEM | Technicalcapabilities |
1 | Layers | 1-10layers |
2 | Max. Boardsize | 2000×610mm |
3 | Min. boardThickness | 2-layer 0.15mm |
4-layer 0.4mm | ||
6-layer 0.6mm | ||
8-layer 1.5mm | ||
10-layer 1.6~2.0mm | ||
4 | Min. lineWidth/Space | 0.1mm(4mil) |
5 | Max. Copperthickness | 10OZ |
6 | Min. S/MPitch | 0.1mm(4mil) |
7 | Min. holesize | 0.2mm(8mil) |
8 | Hole dia. Tolerance(PTH) | ±0.05mm(2mil) |
9 | Hole dia. Tolerance(NPTH) | +0/-0.05mm(2mil) |
10 | Hole positiondeviation | ±0.05mm(2mil) |
11 | Outlinetolerance | ±0.10mm(4mil) |
12 | Twist &Bent | 0.75% |
13 | InsulationResistance | >1012 ΩNormal |
14 | Electricstrength | >1.3kv/mm |
15 | S/Mabrasion | >6H |
16 | Thermalstress | 288°C10Sec |
17 | TestVoltage | 50-300V |
18 | Min. blind/buriedvia | 0.15mm (6mil) |
19 | SurfaceFinished | HAL, ENIG, ImAg, Imsn OSP,Plating AG, Plating gold |
20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium, Copperbase |