Min. Order: | 1 Square Meter |
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Trade Term: | FOB |
Payment Terms: | L/C, D/P, D/A, T/T, WU |
Supply Ability: | 1000square meter/per day |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | wpo098 |
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Means of Transport: | Ocean, Air, Land |
Max pane size: | 14"*20" |
Independence tolerance: | +/-10% |
Aspecr Ratio: | 9:1 |
Layer count: | 1-20 |
Solder mask abrasion: | ≥8H |
Gold finger: | Ni: 80~250u", Au: 1~5u" |
Warp and twist: | ≤0.75% |
Via plug: | Max via size: 24mil (0.6mm) |
Peel Strength: | 1.4N/mm |
Certification: | UL/SGS/ROHS |
Production Capacity: | 1000square meter/per day |
Packing: | Inner vacuum and plastic package,outer carton box package |
Delivery Date: | 3~10days |
Place ofOrigin: | Guangdong China (Mainland) | BrandName: | Kingford | ModelNumber: | kingford pcb-66 |
Number of Layers: | 2 layer | Base Material: | FR4 | Copper Thickness: | 1oz |
Board Thickness: | 1.6mm | Min. Hole Size: | 0.2mm | Min. Line Width: | 3mil |
Min. Line Spacing: | 3mil | Surface Finishing: | OSP/HAL Lead Free | Color: | Green |
Packaging Detail: | Inner packing: vacuum packing/ plastic bag Outer pcaking: standard cartonpacking |
Delivery Detail: | 1-2 days for sample , 6-15 days for mass production |
Standard Features | Standard | Advanced |
Maximum layer count | 16 | 32 |
Maximum Panel Size | 21"x24" | 24"x30" |
Outer Layer Trace/Spacing (1/3 oz) | 0.0035"/0.0035" | 0.0025"/0.003" |
[90µm/90µm] | [64µm/76µm] | |
Inner Layer Trace/Spacing (H oz) | 0.003"/0.003" | 0.002"/0.0025" |
[76µm/76µm] | [50µm/64µm] | |
Maximum PCB thickness | 0.125"[3.2mm] | 0.177"[4.5mm] |
Minimum PCB thickness | 0.008"[0.20mm] | 0.004"[0.10mm] |
Minimum mechancial drill size | 0.008"[0.20mm] | 0.004"[0.10mm] |
Maximum PCB aspect ration | 10:01 | 12:01 |
Maximum copper weight | 5 oz [178µm] | 6 oz [214µm] |
Minimum copper weight | 1/3 oz [12µm] | 1/4 oz [9µm] |
Minimum core thickness | 0.002"[50µm] | 0.0015"[38µm] |
Minimum dielectric thickness | 0.0025"[64µm] | 0.0015"[38µm] |
Minimum Pad Size over Drill | 0.018"[0.46mm] | 0.016"[0.4mm] |
Solder Mask Registration | +/- 0.002"[50µm] | +/- 0.0015"[38µm] |
Mimimum Solder Mask Dam | 0.003"[76µm] | 0.0025"[64µm] |
Copper feature to PCB edge | 0.015"[0.38mm] | 0.010"[0.25mm] |
Tolerance on overall dimensions | +/- 0.004"[100µm] | +/- 0.002"[50µm] |
HDI Features | ||
Capture pad size | 0.010"[0.25mm] | 0.009"[0.22mm] |
Glass reinforced dielectrics | Y | Y |
Maximum aspect ratio | 0.6:1 | 1:01 |
Minimum microvia hole size | 0.004"[100µm] | 0.003"[75µm] |
Stacked Microvias | Y | Y |
Copper Filled Microvias | Y | Y |
Maximum No. of buildup layer | 3+N+3 | 4+N+4 |
Quality System and Certificates | ||
IPC-600, 6012, Class II and III | ||
ISO 9001:2008 | ||
UL: E352816 |