Min. Order: | 1 Square Meter |
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Trade Term: | FOB |
Payment Terms: | L/C, D/P, D/A, T/T, WU |
Supply Ability: | 1000square meter/per day |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | fty980 |
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Means of Transport: | Ocean, Air, Land |
Max pane size: | 14"*20" |
Independence tolerance: | +/-10% |
Aspecr Ratio: | 9:1 |
Layer count: | 1-20 |
Solder mask abrasion: | ≥8H |
Gold finger: | Ni: 80~250u", Au: 1~5u" |
Warp and twist: | ≤0.75% |
Via plug: | Max via size: 24mil (0.6mm) |
Peel Strength: | 1.4N/mm |
Certification: | UL/SGS/ROHS |
Production Capacity: | 1000square meter/per day |
Packing: | Inner vacuum and plastic package,outer carton box package |
Delivery Date: | 3~10days |
Place ofOrigin: | Guangdong China (Mainland) | BrandName: | TWS | ModelNumber: | twsH015K |
Number of Layers: | 4-12 Layers | Base Material: | FR4 | Copper Thickness: | 0.5-1OZ |
Board Thickness: | 0.2-1.6mm | Min. Hole Size: | 0.2mm | Min. Line Width: | 0.1mm |
Min. Line Spacing: | 0.1mm | Surface Finishing: | HASL(Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold P | Solder mask: | Green/Blue/Black/White/Yellow/Redetc |
Max size of finish board: | 9200*900mm | Certification: | UL/SGS/ROHS | Controlled impedance: | ±5% |
Warp&Twist: | 0.7% | Rang of finish boardsthickness: | 0.21~7.0mm | Layer count: | 1~28 |
Impedance control: | ±10% | OEM/ODM: | One-stop service |
Packaging Detail: | vacuum package+carton box |
Delivery Detail: | 7-15 days |
Item | CraftCapacity | |
1 | Layer | 1-30Layers |
2 | Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, HighFrequence ROGERS ,TEFLON, ARLON, Halogen-freeMaterial |
3 | Rang of finish baordsThickness | 0.21-7.0mm |
4 | Max size of finishboard | 900MM*900MM |
5 | Minimum Linewidth | 3mil (0.075mm) |
6 | Minimum Line space | 3mil (0.075mm) |
7 | Min space between pad topad | 3mil (0.075mm) |
8 | Minimum hole diameter | 0.10 mm |
9 | Min bonding paddiameter | 10mil |
10 | Max proportion of drilling hole andboard thickness | 1:12.5 |
11 | Minimum linewidth ofIdents | 4mil |
12 | Min Height of Idents | 25mil |
13 | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP ,etc. |
14 | Soldermask | Green, White, Red, Yellow, Black,Blue, transparent photosensitive soldermask, Strippablesoldermask. |
15 | Minimun thickness ofsoldermask | 10um |
16 | Color of silk-screen | White, Black, Yellowect. |
17 | E-Testing | 100% E-Testing (High VoltageTesting); Flying Probe Testing |
18 | Other test | ImpedanceTesting,Resistance Testing,Microsection etc., |
19 | Date file format | GERBER FILE and DRILLING FILE, PROTELSERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
20 | Special technologicalrequirement | Blind & Buried Vias and HighThickness copper |
21 | Thickness of Copper | 0.5-14oz(18-490um) |