Min. Order: | 1 Square Meter |
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Trade Term: | FOB |
Payment Terms: | L/C, D/P, D/A, T/T, WU |
Supply Ability: | 1000square meter/per day |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | QYU7677 |
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Means of Transport: | Ocean, Air, Land |
Max pane size: | 14"*20" |
Independence tolerance: | +/-10% |
Aspecr Ratio: | 9:1 |
Layer count: | 1-20 |
Solder mask abrasion: | ≥8H |
Gold finger: | Ni: 80~250u", Au: 1~5u" |
Warp and twist: | ≤0.75% |
Via plug: | Max via size: 24mil (0.6mm) |
Peel Strength: | 1.4N/mm |
Certification: | UL/SGS/ROHS |
Production Capacity: | 1000square meter/per day |
Packing: | Inner vacuum and plastic package,outer carton box package |
Delivery Date: | 3~10days |
Place ofOrigin: | Guangdong China (Mainland) | BrandName: | APC | ModelNumber: | FPCam-08050019 |
Number of Layers: | 1-6 | Base Material: | PI(260â TG) | Copper Thickness: | 1/2OZ,1/1OZ |
Board Thickness: | 0.00328"(0.085)---0.016"(0.4mm) | Min. Hole Size: | 0.010"(0.25mm) | Min. Line Width: | 0.2mm |
Min. Line Spacing: | 0.2mm | Surface Finishing: | Nickle andImmersion Gold,HASL,OSP,etc | Finished Board Thickness: | 0.085mm---0.4mm |
Packaging Detail: | Common Safety Package |
Delivery Detail: | 5WD around after the EQ has confirmed |
FPC Processing Capability Of Standard | |||
Item | Description | Common | Special |
1 | NO. OF Layer | 1-4 | 6 |
2 | FINISHED BOARD SIZE(MAX) | 250*600mm | OK |
3 | FINISHED BOARD SIZE(MIN) | 10*15mm | OK |
4 | BOARD THICKNESS(MAX) | 0.016"(0.4mm) | OK |
5 | BOARD THICKNESS(MIN) | 0.00328"(0.085) | OK |
6 | FINISHED BOARD THICKNESS FOLERANCE 0.085mm---0.4mm | ±2mil(±0.05mm) | OK |
7 | DRILL HOLE DIAMETER(MAX) | 0.236"(6.0mm) | OK |
8 | DRILL HOLE DIAMETER(MIN) | 0.010"(0.25mm) | OK |
9 | For Machine Drill FINISHED VIA DIAMETER(MIN) | 0.008"(0.2mm) | OK |
10 | OUTER LAYER BASE COPPER THICKNESS(MIN) | 1/2OZ(0.01778mm) | OK |
11 | OUTER LAYER BASE COPPER THICKNESS(MAX) | 1OZ(0.0355mm) | OK |
12 | INNER LAYER DIELECTRIC THICKNESS(MIN) | 0,0127mm(1/2mil) | OK |
13 | INNER LAYER DIELECTRIC THICKNESS(MAX) | 0.0254mm(1mil) | OK |
14 | BASE.MATERIAL | PI(260°C TG) | OK |
15 | HOLE DIAMETER TOLERANCE(PTH) | ±2mil(±0.05mm) | ±1.5mil |
16 | HOLE DIAMETER TOLERANCE(NPTH) | ±1mil(±0.025mm) | ±1.5mil |
17 | HOLE POSITION TOLERANCE (COMPARED WITH CAD DATA) | ±3mil(±0.076mm) | OK |
18 | PTH HOLE COPPER THICKNESS | over0.5mil(0.0125mm) | OK |
19 | LAVER DESIGN LINE WIDTH/SPACING(MIN) | 4mil/4mil(0.1016mm/0.1016mm)Multilayer 2.5mil/2.5mil(0.0635mm/0.0635mm)Double side,single layer 0.5OZ | OK |
20 | TOLERANCE AFTER ETCHING | ±20%(common) | ±10% for impedance |
21 | IMAGE TO IMAGE TOLERANCE(MIN) | ±5mil(±0.127mm) ±4mil | ±3mil(0.076mm) |
22 | IMAGE TO EDGE TOLERANCE(MIN) | ±4mil(±0.1mm) | OK |
23 | LEGEND MASK REGISTARTION(MIN) | ±6mil(±0.15mm) | OK |
24 | SOLDERMASK REGISTARTION(MIN) | ±6mil(±0.15mm) | OK |
25 | SOLDERMASK THICKNESS(MIN) | 10UM | OK |
26 | CVL REFISTRATION(MIN) | 8mil(4mil) | OK |
27 | CVLL Pressure and glue quantity (MIN) | 5.6mil(2.4mil) | OK |
28 | SOLDER TIN LEAD THICKNESS ON FINGER OR PAD.(MAX) (MIN)AND TOLEARANCE THICKNESS | (1.0mil) (0.1mil)±0.30mil | ±0.15mil |
29 | GOLD FINGER NICKEL THICKNESS(MAX) TOLERANCE THICKNESS | 200u"±100u" | OK |
30 | SOLDER THICKNESS ON PADS(HAL)(MIN) | 0.1mil | OK |
31 | NICKEL THICKNESS FOR ELECTROLESS NICKEL AND INMERSION GOLD(MEASLRED AT THE MINTMUM POINT)(MAX) | 200u"±50u"/1-4u" | OK |
32 | SOLDER THICKNESS ON PADS (HAL) (MAX) | 1.2mil | OK |
33 | SOLDERTHICKNESS ON PADS (HAL) (MIN) | 0.1mil | OK |
34 | PUNCHING HOLE (MIN-MAX) DIAMETER TOLERANCE | 0.5-6.0mm±0.05mm | OK |
35 | THE TOLERANCE OF PASTEING ADHESIVE AND STIFFER | ±0.20mm | ±0.10mil |
36 | PUNCHING DIE DIMENSION TOLERANCE (EDGE TO EDGE)(STEEL DIE)Steel Die | ±4mil(±0.1mm) | ±2mil |
37 | PUNCHING DIE DIMENSION TOLERANCE (HOLE TO EDGE)(STEEL DIE)Steel Die | ±4mil(±0.1mm) | ±2mil |
38 | PUNCHING DIE DIMENSION TOLERANCE (HOLE TO EDGE)(STEEL DIE)cutting die | ±8mil(±0.2mm) | ±6mil |