Min. Order: | 1 Square Meter |
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Trade Term: | FOB |
Payment Terms: | L/C, D/P, D/A, T/T, WU |
Supply Ability: | 1000square meter/per day |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | popokm320 |
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Means of Transport: | Ocean, Air, Land |
Max pane size: | 14"*20" |
Independence tolerance: | +/-10% |
Aspecr Ratio: | 9:1 |
Layer count: | 1-20 |
Solder mask abrasion: | ≥8H |
Gold finger: | Ni: 80~250u", Au: 1~5u" |
Warp and twist: | ≤0.75% |
Via plug: | Max via size: 24mil (0.6mm) |
Peel Strength: | 1.4N/mm |
Certification: | UL/SGS/ROHS |
Production Capacity: | 1000square meter/per day |
Packing: | Inner vacuum and plastic package,outer carton box package |
Delivery Date: | 3~10days |
Place ofOrigin: | Guangdong China (Mainland) | BrandName: | Sograce | ModelNumber: | Multilayerimpedance controlled rigid flex pcb manufacturer |
Number of Layers: | 6-Layer | Base Material: | FR4 | Copper Thickness: | 2OZ |
Board Thickness: | 1.6M | Min. Hole Size: | 0.1MM | Min. Line Width: | 0.075MM |
Min. Line Spacing: | 0.075MM | Surface Finishing: | HASL,Immersiongold,Immersion Silver,Immersion Sn,Osp,etc | Color: | Yellow,Green,Red,Black etc. |
Small order: | Accept | Certificate: | ISO,UL and ROHS | Order MOQ: | 1 piece |
Delivery time: | 3-7 working days | port: | shenzhen&hong kong |
Packaging Detail: | Inner Vaccum Packing Outer Carton Box |
Delivery Detail: | within 3-7 days |
NO | ITEM | Our PCB Technicalcapabilities |
1 | Layers | 1-20layers |
2 | Max.Board size | 2000×610mm |
3 | Min.board Thickness | 2-layer 0.15mm |
4-layer 0.38mm | ||
6-layer 0.55mm | ||
8-layer 0.80mm | ||
10-layer 1.0mm | ||
4 | Min. lineWidth/Space | 0.075mm(3mil) |
5 | Max.Copper thickness | 6OZ |
6 | Min. S/MPitch | 0.075mm(3mil) |
7 | Min. holesize | 0.1mm(4mil) |
8 | Hole dia.Tolerance (PTH) | ±0.05mm(2mil) |
9 | Hole dia.Tolerance (NPTH) | +0/-0.05mm(2mil) |
10 | Holeposition deviation | ±0.05mm(2mil) |
11 | Outlinetolerance | ±0.10mm(4mil) |
12 | Twist& Bent | 0.75% |
13 | InsulationResistance | >1012Ω Normal |
14 | Electricstrength | >1.3kv/mm |
15 | S/Mabrasion | >6H |
16 | Thermalstress | 288°C20Sec |
17 | TestVoltage | 50-300V |
18 | Min.blind/buried via | 0.15mm (6mil) |
19 | SurfaceFinished | HAL,ENIG, ImAg, Imsn OSP, Plating AG, Plating gold |
20 | Materials | FR4,H-TG,Teflon,Rogers,Ceramics,Aluminium,Copper base |