Professional manufacturing audio amplifier module pcb

1) Professional Surface-mounting and Through-hole soldering Technology

2) Various sizes like 1206,0805,0603 components SMT technology

3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.

4) PCB Assembly With UL,CE,FCC,Rohs Approval

5) Nitrogen gas reflow soldering technology for SMT.

6) High Standard SMT&Solder Assembly Line

7) High density interconnected board placement technology capacity.

TWS-PCB in China here, exporting lots of the PCB what you nees.

-More than 15 years' experience of manufacturing PCBs

-Being vendor of Bocsh for over 10years

-Flexibility in production volume from samples to high volume mass production with competitive prices

-Professional engineer teams who are specializing in PCBs and can develop it according to client's requirements

• Full range in PCB: Buried/blind via holes, Impedance control, Heavy Cu up to 12oz, Hard gold, Special teflon and Aluminium based PCB.
• Flexibility in sample Lead time: 2 layers in ONE day, multi-layers in 2~4 days; mass production in 2~4 weeks.

Product lines:

-Rigid PCB( Single-sided PCB,Double-sided PCB,Multi-layer PCB-up to 30layers)

-Rigid-flexible PCB(1 to 16layers)

-Flexible PCB(1 to 8layers)

-HDI PCB

-All kinds of high class PCBs

PCB material we can use:

FR1, FR2, HB,CEM1,CEM3, FR4,High TG/CTI FR4,Halogen Free,Rogers,Aluminium based, Leadfree compatible, Hi Frequency

1) Min. Trace width: 0.20mm
2) Min. Space between trace: 0.20mm
3) Min. Hole size: 0.5mm
4) Thickness tolerance:
A) Single sided: 0.005"
B) Double sided: 0.010"
5) Base materials: Polyimide and polyester
6) Conductor (copper thickness): 0.5oz., 1oz. And 2oz. (RA and ED copper)
7) Cover-layer: Polyimide and polyester (solder mask printing is available)
8) Adhesive material: Epoxy, acrylic and polyester
9) Stiffener materials: FR-4, mylar and polyimide
10) Surface finishes: Flash gold plating, selective gold plating and solder plating Package: Vacuum package  

1. Rigid produce system

    E-Testing Flying Probe Testing

2. PCB Assembly provided available
3. Product diversification with high tech

4. Certificate: ISO 9001, RoHS, UL, ISO14001, TS16949

Technical requirement:

Capacity of pcb

NO	ITEM	Technical Data
1	Layer	2-20 Layers
2	Board material	FR4,FR4 Halogen free,TEFLON Rogers,Getek High-TG(TG>170),Aluminium base
3	Max.Board Size0	457*660mm
4	Min.Board Thickness	2 layers 0.2mm
		4 layers 0.4mm
		6 layers 0.8mm
		8 layers 1.0mm
		10 layers 1.2mm
5	Max.Board Thickness	8.0mm
6	Min.Line Width	0.05mm
7	Min.Line Space	0.05mm
8	Min.Hole Size0	Electroplating Via 0.15mm
		Micro via 0.075mm
9	PTH Wall Thickness)	20-25um
10	Max.finish copper thickness0	8OZ
11	PTH Dia.Tolerance	±0.05mm
12	NPTH Dia.Tolerance	±0.025mm
13	Hole Position Deviation	±0.05mm
14	Outline Tolerance	±0.1mm
15	Min.S/M Pitch	0.08mm
16	Insulation Resistance	3x10Sec, 288°C
17	Warp and Twist	≤0.7%
18	Electric Strength	>1.3KV/mm
19	Peel Strength	≥1.4N/mm
20	Solder Mask Abrasion	≥6H
21	Flammability	94V0
22	Impedance Control	±5%

Contact Supplier