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China high quality blackberry mobile pcb boards

0.1~1.0 USD
Min. Order: 5 Piece/Pieces
Payment Terms: Paypal, T/T, WU
Supply Ability: 120000 Square Meter /Month
Place of Origin: Guangdong

Company Profile

Location: Shenzhen, Guangdong, China (Mainland)
Business Type: Manufacturer
Main Products: PCB

Product Detail

Model No.: TWS-H21M
Means of Transport: Ocean, Air, Land
Brand Name: TWS
Base Material: FR-1,FR-2,FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,Aluminum material
Copper Thickness: 0.5-4.0oz
Board Thickness: 0.2mm-7mm
Min. Hole Diameter: 0.25mm
Min. Line Width: 0.075mm(3mil)
Min. Line Spacing: 0.075mm(3mil)
Surface Finishing: HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating
Layer: 1-28 Layer
Solder Mask: green/red/blue/white/yellow
MAX.Board Size: 9200*900mm
Certification: UL/SGS/ROHS
Controlled impedance: ±5%
Warp&Twist: 0.7%
Rang of finish boards thickness: 0.21~7.0mm
Impedance control: ±10%
OEM/ODM: One-stop service
PCB standard: IPC-A-610D
Production Capacity: 120000 Square Meter /Month
Packing: vacuum packaging and carton box
Delivery Date: 5-15 working days after your payments
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Product Description

blackberry mobile pcb boards

Contract Manufacturing
- Engineering Services
- PCB Design & Assembly
- Product Design
- Prototyping
- Cable and Wire Assemblies
- Plastics and Molds



Technical requirement:
1) Professional Surface-mounting and Through-hole soldering Technology
2) Various sizes like 1206,0805,0603 components SMT technology
3) ICT(In Circuit Test),FCT(Functional Circuit Test) technology.
4) PCB Assembly With UL,CE,FCC,Rohs Approval
5) Nitrogen gas reflow soldering technology for SMT.
6) High Standard SMT&Solder Assembly Line
7) High density interconnected board placement technology capacity.


Quote requirement:
  • Gerber file of the bare PCB board
  • BOM (Bill of material) for assembly
  • To short the lead time, please kindly advise us if there is any acceptable components substitution.
  • Testing Guide & Test Fixtures if necessary
  • Programming files & Programming tool if necessary
  • Schematic if necessary
OEM/ODM/EMS Services for PCBA:
  • PCBA, PCB assembly: SMT & PTH & BGA
  • PCBA and enclosure design
  • Components sourcing and purchasing
  • Quick prototyping
  • Plastic injection molding
  • Metal sheet stamping
  • Final assembly
  • Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)
  • Custom clearance for material importing and product exporting
Orientronic PCB assembly Equipment:
  • SMT Machine: SIEMENS SIPLACE D1/D2 / SIEMENS SIPLACE S20/F4
  • Reflow Oven: FolunGwin FL-RX860
  • Wave Soldering Machine: FolunGwin ADS300
  • Automated Optical Inspection (AOI): Aleader ALD-H-350B
  • Fully Automatic SMT Stencil Printer: FolunGwin Win-5

Capacity of pcb
NO
ITEM
Technical Data
1
Layer
2-20
Layers
2
Board
material
FR4,FR4
Halogen free,TEFLON Rogers,Getek High-TG(TG>170),Aluminium base
3
Max.Board
Size0
457*660mm
4
Min.Board Thickness
2 layers 0.2mm
4 layers 0.4mm
6 layers 0.8mm
8 layers 1.0mm
10 layers 1.2mm
5
Max.Board
Thickness
8.0mm
6
Min.Line
Width
0.05mm
7
Min.Line
Space
0.05mm
8
Min.Hole Size0
Electroplating
Via 0.15mm
Micro via 0.075mm
9
PTH
Wall Thickness)
20-25um
10
Max.finish
copper thickness0
8OZ
11
PTH
Dia.Tolerance
±0.05mm
12
NPTH
Dia.Tolerance
±0.025mm
13
Hole
Position Deviation
±0.05mm
14
Outline
Tolerance
±0.1mm
15
Min.S/M
Pitch
0.08mm
16
Insulation
Resistance
3x10Sec,
288°C
17
Warp
and Twist
≤0.7%
18
Electric
Strength
>1.3KV/mm
19
Peel
Strength
≥1.4N/mm
20
Solder
Mask Abrasion
≥6H
21
Flammability
94V0
22
Impedance
Control
±5%


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