Min. Order: | 5 Piece/Pieces |
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Payment Terms: | Paypal, T/T, WU |
Supply Ability: | 120000 Square Meter /Month |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | TWS-G10K |
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Means of Transport: | Ocean, Air, Land |
Brand Name: | TWS |
Base Material: | FR-1,FR-2,FR-4,CEM-1,CEM-3,Hight TG,FR4 Halogen Free,Aluminum material |
Copper Thickness: | 0.5-4.0oz |
Board Thickness: | 0.2mm-7mm |
Min. Hole Diameter: | 0.25mm |
Min. Line Width: | 0.075mm(3mil) |
Min. Line Spacing: | 0.075mm(3mil) |
Surface Finishing: | HALS/HALS lead free,Chemical tin,Chemical Gold,Immersion gold Inmersion Silver/Gold,Osp,Gold Plating |
Layer: | 1-28 Layer |
Solder Mask: | green/red/blue/white/yellow |
MAX.Board Size: | 9200*900mm |
Certification: | UL/SGS/ROHS |
Controlled impedance: | ±5% |
Warp&Twist: | 0.7% |
Rang of finish boards thickness: | 0.21~7.0mm |
Impedance control: | ±10% |
OEM/ODM: | One-stop service |
PCB standard: | IPC-A-610D |
Production Capacity: | 120000 Square Meter /Month |
Packing: | vacuum packaging and carton box |
Delivery Date: | 5-15 Days |
Quantity | Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000 |
Type of Assembly | SMT,Thru-hole |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
Components | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
Bare Board Size | Smallest:0.25*0.25 inches Largest:20*20 inches |
File Formate | Bill of Materials Gerber files Pick-N-Place file |
Types of Service | Turn-key,partial turn-key or consignment |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test,X-ray Inspection AOI Test |
PCB assembly process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |
Item | Manufacture Capability | |
Material | FR-4 / Lead free Materials (RoHS Compliant) /CEM-3, Aluminium, Metal based | |
Layer No. | 1-12 | |
Finished Board thickness | 0.2 mm-3.8mm'(8 mil-150 mil) | |
Board Thickness Tolerance | ±10% | |
Cooper thickness | 0.5 OZ-2OZ | |
Copper Plating Hole | 18-40 um | |
Impedance Control | ±10% | |
Warp&Twist | 0.70% | |
Peelable | 0.012"(0.3mm)-0.02'(0.5mm) | |
Images | ||
Min Trace Width (a) | 0.1mm (4 mil) | |
Min Space Width (b) | 0.1mm (4 mil) | |
Min Annular Ring | 0.1mm (4 mil) | |
SMD Pitch (a) | 0.2 mm(8 mil) | |
BGA Pitch (b) | 0.2 mm (8 mil) | |
Solder Mask | ||
Min Solder Mask Dam (a) | 0.0635 mm (2.5mil) | |
Soldermask Clearance (b) | 0.1mm (4 mil) | |
Min SMT Pad spacing (c) | 0.1mm (4 mil) | |
Solder Mask Thickness | 0.0007"(0.018mm) | |
Holes | ||
Min Hole size (CNC) | 0.2 mm (8 mil) | |
Min Punch Hole Size | 0.9 mm (35 mil) | |
Hole Size Tol (+/-) | PTH:±0.075mm;NPTH: ±0.05mm | |
Hole Position Tol | ±0.075mm | |
Plating | ||
HASL | 2.5um | |
Lead free HASL | 2.5um | |
Immersion Gold | Nickel 3-7um Au:1-5u'' | |
OSP | 0.2-0.5um | |
Outline | ||
Panel Outline Tol (+/-) | CNC: ±0.125mm, Punching: ±0.15mm | |
Beveling | 30°45° | |
Gold Finger angle | 15° 30° 45° 60° | |
Certificate | ROHS, ISO9001:2008, SGS, UL certificate |