Min. Order: | 5 Piece/Pieces |
---|---|
Trade Term: | FOB |
Payment Terms: | T/T, WU |
Supply Ability: | 300000 Square Meter/Square Meters / Month |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
---|---|
Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | TWS-K74I |
---|---|
Means of Transport: | Ocean, Air, Land |
Number of Layers: | 4-Layer |
Brand Name: | tws |
Base Material: | fr4 |
Copper Thickness: | 1oz |
Board Thickness: | 1.6mm |
Min. Hole Size: | 0.15mm |
Min. Line Width: | 0.2mm |
Min. Line Spacing: | 0.2mm |
Surface finishing: | HASL&ENIG |
Solder mask: | Green/Blue/Black/White/Yellow/Red etc |
Max size of finish board: | 9200*900mm |
Certification: | UL/SGS/ROHS |
Controlled impedance: | ±5% |
Warp&Twist: | 0.7% |
Rang of finish boards thickness: | 0.21~7.0mm |
Layer count: | 1~28 |
OEM/ODM: | One-stop service |
PCB standard: | IPC-A-610D |
Production Capacity: | 300000 Square Meter/Square Meters / Month |
Packing: | vacuum package+carton box |
Delivery Date: | 10-15 working days for mass pcb order. |
Files | Gerber, Protel, Powerpcb, Autocad, Cam350, etc |
Material | FR-4, Hi-Tg FR-4, Lead free Materials (RoHS Compliant) , CEM-3, CEM-1, Aluminium, High frequency Material (Rogers, Teflon, Taconic) |
Layer No. | 1 - 30 Layers |
Board thickness | 0.0075"(0.2mm)-0.125"(3.2mm) |
Board Thickness Tolerance | ±10% |
Copper thickness | 0.5OZ - 4OZ |
Impedance Control | ±10% |
Warpage | 0.075%-1.5% |
Peelable | 0.012"(0.3mm)-0.02'(0.5mm) |
Min Trace Width (a) | 0.005"(0.125mm) |
Min Space Width (b) | 0.005"(0.125mm) |
Min Annular Ring | 0.005"(0.125mm) |
SMD Pitch (a) | 0.012"(0.3mm) |
pcb with green solder mask and LF-FREE surface finishing BGA Pitch (b) | 0.027"(0.675mm) |
Regesiter torlerance | 0.05mm |
Min Solder Mask Dam (a) | 0.005"(0.125mm) |
Soldermask Clearance (b) | 0.005"(0.125mm) |
Min SMT Pad spacing (c) | 0.004"(0.1mm) |
Solder Mask Thickness | 0.0007"(0.018mm) |
Hole size | 0.01"(0.25mm)-- 0.257"(6.5mm) |
Hole Size Tol (+/-) | ±0.003"(±0.0762mm) |
Aspect Ratio | 6:01 |
Hole Registration | 0.004"(0.1mm) |
HASL | 2.5um |
Lead free HASL | 2.5um |
Immersion Gold | Nickel 3-7um Au:1-3u'' |
OSP | 0.2-0.5um |
Panel Outline Tol (+/-) | ±0.004''(±0.1mm) |
Beveling | 30°45° |
V-cut | 15° 30° 45° 60° |
Surface finish | HAL, HASL Lead Free, Immersion gold, Gold plating, Gold finger, immersion silver, immersion Tin, OSP, Carbon ink, |
Certificate | ROHS ISO9001:2000 TS16949 SGS UL |
Special requirements | Buried and blind vias, Impedance control, via plug, BGA soldering and gold finger |