Min. Order: | 5 Piece/Pieces |
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Trade Term: | FOB |
Payment Terms: | T/T, WU |
Supply Ability: | 300000 Square Meter/Square Meters / Month |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | tws-017k |
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Means of Transport: | Ocean, Air, Land |
Number of Layers: | 4-Layer |
Brand Name: | tws |
Base Material: | fr4 |
Copper Thickness: | 1oz |
Board Thickness: | 1.6mm |
Min. Hole Size: | 0.15mm |
Min. Line Width: | 0.2mm |
Min. Line Spacing: | 0.2mm |
Surface finishing: | HASL&ENIG |
Solder mask: | Green/Blue/Black/White/Yellow/Red etc |
Max size of finish board: | 9200*900mm |
Certification: | UL/SGS/ROHS |
Controlled impedance: | ±5% |
Warp&Twist: | 0.7% |
Rang of finish boards thickness: | 0.21~7.0mm |
Layer count: | 1~28 |
OEM/ODM: | One-stop service |
PCB standard: | IPC-A-610D |
Production Capacity: | 300000 Square Meter/Square Meters / Month |
Packing: | vacuum package+carton box |
Delivery Date: | 10-15 working days for mass pcb order. |
Layer | 1,2,4 or 6,upto 18 layer |
Material | FR4,CEM1,CEM3,Hight TG,FR4 Halogen Free,FR1,FR2 |
Order Quantity | 1-500,000 |
Board shape | Rectangular,round,slots,cutouts,complex,irregular |
Board type | Rigid,flexible,rigid-flexible |
Board material | FR-4,glass epoxy,FR4 High Tg,Rohs compliant,Aluminum,Rogers,etc |
Board cutting | Shear,V-score,tab-routed |
Board thickness | 0.2~4.0mm,Flex 0.01~0.25'' |
Copper weight | 1.0,1.5,2.0oz |
Solder mask | Double-sided green LPI,Also support red,white,yellow,blue,black |
Silk screen | Double-sided or single-sided in white,yellow,black,or negative |
Silk screen min line width | 0.006'' or 0.15mm |
Max board dimensions | 20inch*20inch or 500mm*500mm |
Min drill hole diameter | 0.01'',0.25mm.or 10 mils |
Surface finish | HASL,Nickle,Imm Gold,Imm Tin,Imm Silver,OSP etc |
Board thickness tolerance | ± 10% |
Copper weight tolerance | ± 0.25oz |
Minimal slot width | 0.12'',3.0mm,or 120mils |
V-score depth | 20-25% of board thickness |
Plated through holes | Yes |
Sink holes | Yes |
Design file format | Gerber RS-274X,274D,Eagle and AutoCAD'S DXF,DWG |
Single,Double sided | Four layer | Six layer | Above eight layer | HDI | |
Sample lead time(Normal) | 5-6 | 6-7 | 7-8 | 10-12 | 15-20 |
Sample lead time(Fastest) | 48 to 72 hours | 5 | 6 | 6-7 | 12 |
Mass production lead time(First batch) | 7-9 | 10-12 | 13-15 | 16 | 20 |
Quantity | Prototype&Low Volume PCB Assembly,from 1 Board to 250,is specialty,or up to 1000 |
Type of Assembly | SMT,Thru-hole |
Solder Type | Water Soluble Solder Paste,Leaded and Lead-Free |
Components | Passive Down to 0201 size BGA and VFBGA Leadless Chip Carriers/CSP Double-sided SMT Assembly Fine Pitch to 0.8mils BGA Repair and Reball Part Removal and Replacement |
Bare Board Size | Smallest:0.25*0.25 inches Largest:20*20 inches |
File Formate | Bill of Materials Gerber files Pick-N-Place file |
Types of Service | Turn-key,partial turn-key or consignment |
Component packaging | Cut Tape,Tube,Reels,Loose Parts |
Turn Time | Same day service to 15 days service |
Testing | Flying Probe Test,X-ray Inspection AOI Test |
PCB assembly process | Drilling-----Exposure-----Plating-----Etaching & Stripping-----Punching-----Electrical Testing-----SMT-----Wave Soldering-----Assembling-----ICT-----Function Testing-----Temperature & Humidity Testing |
NO | ITEM | Technical Data |
1 | Layer | 2-20 Layers |
2 | Board material | FR4,FR4 Halogen free,TEFLON Rogers,Getek High-TG(TG>170),Aluminium base |
3 | Max.Board Size0 | 457*660mm |
4 | Min.Board Thickness | 2 layers 0.2mm |
4 layers 0.4mm | ||
6 layers 0.8mm | ||
8 layers 1.0mm | ||
10 layers 1.2mm | ||
5 | Max.Board Thickness | 8.0mm |
6 | Min.Line Width | 0.05mm |
7 | Min.Line Space | 0.05mm |
8 | Min.Hole Size0 | Electroplating Via 0.15mm |
Micro via 0.075mm | ||
9 | PTH Wall Thickness) | 20-25um |
10 | Max.finish copper thickness0 | 8OZ |
11 | PTH Dia.Tolerance | ±0.05mm |
12 | NPTH Dia.Tolerance | ±0.025mm |
13 | Hole Position Deviation | ±0.05mm |
14 | Outline Tolerance | ±0.1mm |
15 | Min.S/M Pitch | 0.08mm |
16 | Insulation Resistance | 3x10Sec, 288°C |
17 | Warp and Twist | ≤0.7% |
18 | Electric Strength | >1.3KV/mm |
19 | Peel Strength | ≥1.4N/mm |
20 | Solder Mask Abrasion | ≥6H |
21 | Flammability | 94V0 |
22 | Impedance Control | ±5% |