Min. Order: | 1 Square Meter |
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Trade Term: | FOB |
Payment Terms: | L/C, D/P, D/A, T/T, WU |
Supply Ability: | 1000square meter/per day |
Place of Origin: | Guangdong |
Location: | Shenzhen, Guangdong, China (Mainland) |
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Business Type: | Manufacturer |
Main Products: | PCB |
Model No.: | SYI 99886 |
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Means of Transport: | Ocean, Air, Land |
Max pane size: | 34"*25" |
Independence tolerance: | +/-18% |
Aspecr Ratio: | 10:7 |
Layer count: | 1-24 |
Solder mask abrasion: | ≥10H |
Gold finger: | Ni: 80~250u", Au: 1~5u" |
Warp and twist: | ≤0.55% |
Via plug: | Max via size: 24mil (0.6mm) |
Peel Strength: | 1.4N/mm |
Certification: | UL/SGS/ROHS |
Production Capacity: | 1000square meter/per day |
Packing: | Inner vacuum and plastic package,outer carton box package |
Delivery Date: | 3~10days |
NO | Item | Craft Capacity |
1 | Layer | 1-30 Layers |
2 | Base Material for PCB | FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
3 | Rang of finish baords Thickness | 0.21-7.0mm |
4 | Max size of finish board | 900MM*900MM |
5 | Minimum Linewidth | 3mil (0.075mm) |
6 | Minimum Line space | 3mil (0.075mm) |
7 | Min space between pad to pad | 3mil (0.075mm) |
8 | Minimum hole diameter | 0.10 mm |
9 | Min bonding pad diameter | 10mil |
10 | Max proportion of drilling hole and board thickness | 1:12.5 |
11 | Minimum linewidth of Idents | 4mil |
12 | Min Height of Idents | 25mil |
13 | Finishing Treatment | HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
14 | Soldermask | Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. |
15 | Minimun thickness of soldermask | 10um |
16 | Color of silk-screen | White, Black, Yellow ect. |
17 | E-Testing | 100% E-Testing (High Voltage Testing); Flying Probe Testing |
18 | Other test | ImpedanceTesting,Resistance Testing, Microsection etc., |
19 | Date file format | GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
20 | Special technological requirement | Blind & Buried Vias and High Thickness copper |
21 | Thickness of Copper | 0.5-14oz (18-490um) |