NO | ITEM | Technical capabilities |
1 | Layers | 1- 20 layers |
2 | Max Board Size | 610x610mm |
3 | Min Board Thickness | 2 layers - 8mil (0.2mm) |
4 | | 4 layers - 16mil (0.4mm) |
5 | | 6 layers - 24mil (0.6mm) |
6 | | 8 layers - 32mil (0.8mm) |
7 | | 10 layers - 40mil (1.0mm) |
8 | Max Board Thickness | 280mil (7mm) |
9 | Min Line Width | 3 mil (0.075mm) |
10 | Min Line Space | 3 mil (0.075mm) |
11 | Min Hole Size | 6 mil (0.15mm) |
12 | PTH dia tolerance | +/- 2mil (0.05mm) |
13 | NPTH hole dia tolerance | /1mil (0.025mm) |
14 | Hole Position Deviation | /-2mil (0.05mm) |
15 | Outline Tolerance | +/- 4mil (0.1mm) |
16 | S/M Pitch | 3mil (0.075mm) |
17 | Aspect ratio (AR) | 1;12 |
18 | Finished Copper Thickness | 7 oz |
19 | Profiling | Punching, Routing, V-CUT, Beveling |
20 | Impedance Control | +/- 5% |
21 | Insulation Resistance | 1E+12Ω(Normal) |
22 | Thermal Shock | 3*288Sec |
23 | Warp and Twist | <= 0.7% |
24 | Electric Strength | > 1.3KV/mm |
25 | Peel Strength | 1.4N/mm |
26 | Solder Mask Color | Green/Yellow/Black/White/Red/Blue |
27 | Solder Mask Abrasion | >= 6H |
28 | Flammability | 94V-0 |
29 | Surface Finishing | HASL, LF-HASL, ENIG, Flash Gold, Immersion Tin, Immersion Silver, OSP,Gold Finger, Peelable Mask, Carbon Printing. |
31 | Material | FR-4, ROGERS, Taconic, ARLON, BT, Ceramic, Aluminum |
32 | PCB Packing | Inner packing: Vacuum packing / Plastic bag |
33 | | Outer packing: Standard carton packing |
34 | Certificate | UL-351742, ISO 9001, SGS.DQS |
35 | Target Market(s) | Eastern Europe, Hong Kong/ Macao/ Taiwan, Japan & Korea, Latin America, Mainland China, North America, Northern Europe, Oceania, Southeast Asia, Western Europe |
36 | Payment Terms | T/T, L/C |
37 | Minimum Order | 20sqm |
38 | Lead Time Delivery Time | 15 days |
39 | Sample Available | YES |
40 | FOB Port | Shenzhen |
41 | Loading Info | Depend on customer |
42 | Packing Info | Standard carton with min cardboard on six sides to protect the goods. |