LED Solder Reflow/Lead Free Reflow Oven/BGA Reflow
1.0 USD
| Min. Order: | 1 Set/Sets |
|---|---|
| Trade Term: | FOB |
| Payment Terms: | T/T |
| Supply Ability: | 100set /month |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
Product Detail
| Model No.: | E8 |
|---|---|
| Structure: | Belt Conveyor |
| Material: | Plastic |
| Material Feature: | Fire Resistant |
| Brand Name: | ETA reflow oven |
| color: | gery |
| Production Capacity: | 100set /month |
| Packing: | wooden box |
| Delivery Date: | 30days |
Product Description
LED solder reflow/lead free reflow oven /hot air reflow oven/BGA reflow/SMT reflow /SMD reflow
1, Windows XP O/S, so simply as Chinese and English interface onscreen alternative available.
2, The digital control system adopted with PLC +Modular circuit to stabilized and accurate of repetitive precision.
3, Intelligent diagnosis system (IDS) has the function of trouble remind, alarm, list-out, report saving.
4, Temperature and blower speed controlling adjustable independently, to meet the high-precision requirements.
5, To minimize the temperature difference of various volumes of components by newly chambers design, with enhance the reliability and protective of each solder joints.
6, Step forced cooling system to easily achieve the requirements of strict lead-free processes (cooling slope: ≥ 3degree/sec. )
7, Center support and dual rail is optional.
1, Windows XP O/S, so simply as Chinese and English interface onscreen alternative available.
2, The digital control system adopted with PLC +Modular circuit to stabilized and accurate of repetitive precision.
3, Intelligent diagnosis system (IDS) has the function of trouble remind, alarm, list-out, report saving.
4, Temperature and blower speed controlling adjustable independently, to meet the high-precision requirements.
5, To minimize the temperature difference of various volumes of components by newly chambers design, with enhance the reliability and protective of each solder joints.
6, Step forced cooling system to easily achieve the requirements of strict lead-free processes (cooling slope: ≥ 3degree/sec. )
7, Center support and dual rail is optional.
| Model | S10 |
| GENERAL | |
| Outside dimension | 5840 x 1360 x 1490mm |
| Standard color | Computer grey |
| Weight | 2400kg |
| Number of heating zones | Up10/bottm10 |
| Lengthof heating zones | 3480mm |
| Number of cooling zones | 2(built-in) |
| Exhaust volume | 10M3/min*2 exhausts |
| Standard feature of control system | |
| Electric supply required | 3phase, 380V 50/60Hz |
| Electric power required | 67KW |
| Power for warm up | 36KW |
| Power consumption | 12KW |
| Heating pattern | Up & Bottom Hot air |
| Warming time | Approx. 30minute |
| Temp. setting range | Room temp__300degree |
| Control system | PLC+ Computer |
| Temperature control method | PID close loop control +SSR driving |
| Temperature control precision | ± 1.0degree |
| Temperature deviation on PCB | ± 1.5degree |
| Data storage | Process data and status storage (80GB) |
| Abnormal alarm | Abnormal temperature(extra-high/extra-low temp) |
| Board dropped alarm | Tower light: yellow warming: Green-normal: Red-abnormal |
| Standard features of conveyor system | |
| Max. width of PCB | Max: 500mm(Standard) |
| Rail Number | 1 Lane Or 2 Lane (option) |
| Components clearance | Top/bottom clearance of PCB is 25mm |
| Conveyor height | Light → right(option: R→ L) |
| PCB transmission agent | Air-reflow=chain +mesh (Standard) |
| Conveyor height | 900± 20mm |
| Conveyor speed range | 300~2000mm/min |