Large Conveyor Lead-Free Reflow Oven A600
1.0 USD
| Min. Order: | 1 Bag/Bags |
|---|---|
| Trade Term: | FOB |
| Payment Terms: | T/T |
| Supply Ability: | 100set /month |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
Product Detail
| Model No.: | A600 |
|---|---|
| Structure: | Belt Conveyor |
| Material: | Polyester |
| Material Feature: | Heat Resistant |
| Brand Name: | ETA |
| color: | gery |
| Production Capacity: | 100set /month |
| Packing: | wooden box |
| Delivery Date: | 30days |
Product Description
Large Conveyor Lead-Free Reflow Oven S8
FEATURES
1. Windows XP system, randomly shift Chinese interface to English interface, easy to operate;
2, PLC + modular control, stable and reliable, more accurate repeat;
3, Dual temperature sensor, double safety control mode, if abnormal the system will automatically cut off the heating power;
4, Using the up-down independent temperature control and adjustable speed design, to meet a variety of high-precision lead-free soldering process requirements;
5, New furnace design effectively reduces the temperature difference between the size of the components to ensure the reliability of solder joints at the same time, eliminating the potential dangers of thermal damage to the components;
6. Staged cooling system easily achieve the cooling rate of the various types of lead-free solder paste (≥ 3 ° C / s);
7. Reflow oven can be optionaly equipped with central support and double track.
FEATURES
1. Windows XP system, randomly shift Chinese interface to English interface, easy to operate;
2, PLC + modular control, stable and reliable, more accurate repeat;
3, Dual temperature sensor, double safety control mode, if abnormal the system will automatically cut off the heating power;
4, Using the up-down independent temperature control and adjustable speed design, to meet a variety of high-precision lead-free soldering process requirements;
5, New furnace design effectively reduces the temperature difference between the size of the components to ensure the reliability of solder joints at the same time, eliminating the potential dangers of thermal damage to the components;
6. Staged cooling system easily achieve the cooling rate of the various types of lead-free solder paste (≥ 3 ° C / s);
7. Reflow oven can be optionaly equipped with central support and double track.