With the addition of the optional MNVC, the component range can be increased even more for greater flexibility.
Chip
23,300CPH(laser centering/Optimum)(0.155Sec./chip)
18,300CPH(laser centering/IPC 9850)
IC
4,600CPH (vision centering with optional MNVC)
One multi-nozzle laser head (6 nozzles)
From 0402 (01005) to 33.5mm square components
Vision centering system (optional, featuring bottom, side, and back lighting, all ball recognition)
1 Actual throughput may vary.
2 Please download brochure for details
Board size : M size (330×250mm)
L size (410×360mm)
L-Wide size(510×360mm) (option)
E size (510×460mm)*1
Component size :
Laser recognition : 0402 (01005) 33.5mm
Vision recognition
Standard camera : 3mm*2 33.5mm
High-resolution camera (option) : 1.0×0.5mm*3 20mm
Placement speed
Chip
Optimum : 0.155Sec./chip(23,300CPH)
IPC9850 : 18,300CPH
IC*4 : 4,600CPH*5
Placement accuracy
Laser recognition : ±0.05mm(Cpk 1)
Vision recognition: ±0.04mm
Feeder inputs : Max. 80 on 8mm T/F*6
1 Please ask for details on E size board.
2 When using MNVC. (option)
3 When using both high-resolution camera and MNVC. (option)
4 Effective tact: The IC placement speed indicates an estimated value obtained when the machine places 36 QFP (100 pins or more) or BGA components (256 balls or more) on a M size board.
(CPH=number of components placed for one hour)
5 Estimated value when using MNVC (option) and picking up components simultaneous with all nozzles.
6 Including matrix tray changer, max 110.