Tin solder paste, lead free solder paste with SMT welding
25.0~29.0 USD
| Min. Order: | 1 Kilogram |
|---|---|
| Payment Terms: | T/T, WU |
| Supply Ability: | 50KG PER DAY |
| Place of Origin: | Guangdong |
Company Profile
| Location: | Shenzhen, Guangdong, China (Mainland) |
|---|---|
| Business Type: | Manufacturer |
| Main Products: | Tin Solder Wire, Tin Solder Bar, Tin Solder Paste |
Product Detail
| Model No.: | Sn96.5Ag3.0Cu0.5 |
|---|---|
| Means of Transport: | HKEMS, Air |
| Brand Name: | JF |
| Length: | JuFeng |
| Type: | manufacture |
| name: | tin solder paste |
| Package: | 500g per jar |
| item: | Sn96.5Ag3.0Cu0.5 |
| Production Capacity: | 50KG PER DAY |
| Packing: | BOTTLE |
| Delivery Date: | 5 WORKING DAYS |
Product Description
Solder paste is a run-off, one is isolated to prevent oxidation air, another increase capillary effect, increase the wettability, prevent virtual welding, solder paste: white crystalline powder. Content is 99.0%, acid value, 0.5 mgKOH/g, mp, 112 ℃, soluble in ethanol, isopropyl alcohol. Widely used in organic synthesis, pharmaceutical intermediates, used in flux, solder paste plays a role of surfactant in the production, high resistance, strong activity, to highlight and solder joint has certain effect. Is the activity of the flux of all additives, widely used in high precision electronic components do high-grade environment-friendly flux
Of solder paste reflow soldering is a main plate of the interconnection method of SMT assembly process, the major problems affecting reflow soldering include bottom element fixed, lack of full, intermittent wetting, low residue, clearance, solder ball and solder beads, welding fillet weld is raised, TombstoningBGA formed into a ball, porosity, etc., the problem is not limited to, in this article did not mention the problem and leaching effect, intermetallic compound, non-wetting, contorted, lead-free soldering, etc. Only solve these problems, reflow soldering, as an important part of the SMT assembly method, can in the time of the ultrafine spacing successfully keep continue.
Of solder paste reflow soldering is a main plate of the interconnection method of SMT assembly process, the major problems affecting reflow soldering include bottom element fixed, lack of full, intermittent wetting, low residue, clearance, solder ball and solder beads, welding fillet weld is raised, TombstoningBGA formed into a ball, porosity, etc., the problem is not limited to, in this article did not mention the problem and leaching effect, intermetallic compound, non-wetting, contorted, lead-free soldering, etc. Only solve these problems, reflow soldering, as an important part of the SMT assembly method, can in the time of the ultrafine spacing successfully keep continue.