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Custom 6 Layer PCB Board Assembly, High TG Multilayer PCB Board Immersion Silver For Motherboard

Place of Origin: Zhejiang

Company Profile

Location: Shenzhen, Guangdong, China (Mainland)
Business Type: Manufacturer
Main Products: PCB Board Assembly

Product Description

Custom 6 Layer PCB Board Assembly, High TG Multilayer PCB Board Immersion Silver For Motherboard

 

Fabrication data inputs: Gerber data RS-274-X or RS-274-D with aperture list and drill files, design file with Protel, PAD2000, POWERPCB, ORCAD

  • Layers 2-30 L
  • Material Types Fr-4, Fr-5, High-Tg, Halogen Free, Rogers,
  • Isola, Taconic, Arlon, Teflon, Aluminum Based
  • Max. Panel Dimension 39000mil * 47000mil / 1000mm * 1200mm
  • Outline Tolerance ±4mil ±0.10mm
  • Board Thickness 8mil-236mil / 0.2mm-6.0mm
  • Board Thickness Tolerance ±10%
  • Dielectric Thickness 3mil-8mil / 0.075mm-0.20mm
  • Min. Track Width 3mil / 0.075mm
  • Min. Track Space 3mil / 0.075mm
  • External Cu Thickness HOZ-6OZ / 17um~210um
  • Internal Cu Thickness HOZ-6OZ / 17um~210um
  • Drilling Bit Size ( CNC ) 6mil-256mil / 0.15mm-6.50mm
  • Finished Hole Dimension 4mil-236mil / 0.1mm—6.0mm
  • Hole Tolerance ±2mil / ±0.05mm
  • Hole Position Tolerance ±2mil / ±0.05mm
  • Laser Drilling Hole Size 4mil / 0.1mm
  • Aspect Ration 12:1
  • Solder Mask Green, Blue, White, Black, Red, Yellow, Purple, etc.
  • Min Solder mask Bridge 2mil / 0.050mm
  • Plugged Hole Diameter 8mil-20mil / 0.20mm-0.50mm
  • Impedance Control V-scoring ±10%
  • Surface Finishing HASL, HASL(lead Free), Immersion Gold, Immersion Tin,
  • Immersion Silver, OSP, Hard Gold( up to 100u”)
  • UL and TS16949: 2002 marks
  • Special requirements: buried and blind vias, impedance control, via plug, BGA soldering and gold finger
  • Profiling: punching, routing, V-cut and beveling
  • OEM services to all sorts of printed circuit board assembly as well as electronic encased products are provided

 

 

PCB assembly:

  • Consumer, computer, communication, industrial, security, power, traffic control board SMD, DIP, AI OEM/ODM assembly
  • Complete product including plastics, metal works, microchip programming and functional testing process small order, high-mixed accept turn-key service including components procurement, produce, quality check, package, logistics

 

 

We provide total solutions including:

  • Product development: for single-sided and multilayer PCBA
  • Design: layout and re-layout
  • Tooling: plastic injection molding and metal casting
  • Manufacturing: SMT, BGA and DIP
  • Quality certification: ICT and FCT tests
  • Aftersales services
  • OEM and ODM project is accepted

Equipment in our PCBA facilities includes:

  • Functional, electrical and in-circuit testing equipment
  • Optical microscopes
  • NC data programming machines
  • Multifunction placement machines
  • Full-vision solder printing machines
  • Full-vision high-sped pick-and-place machines
  • BTU reflow machines
  • Microfocus X-ray fluoroscopy system

 

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