Brand: KO
Material: Diamond
Diameter: 6-900mm
Line speed: 35~80m/s
Grit: 40#~W3.5 (mesh)
Application: tungsten carbide, pcd, pcbn, ceramic, cermet
Binding Agent: Resin
Certification: ISO 9001:2000
MOQ: 5 pieces
Features:
The resin bond products have the features of good self-sharpening, sharp cutting, high efficiency, low roughness of work piece surface, few heat generating and without burning workpiece. They are suitable for high efficiency and
precision grinding of most workpieces.
Application:
Resin bond diamond products: mainly used for machining tungsten carbide, ceramic materials, magnetic materials, silicon materials, thermal spraying alloy materials and so on.
Contact: owen @ kosuperhard.com
Skype: owenko11