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ENIG LF HDI PCB High Density Interconnection PCB Board

0.1~100.0 USD
Min. Order: 1 Piece/Pieces
Trade Term: FOB
Payment Terms: Paypal, L/C, T/T, WU
Supply Ability: 50k sqm/M
Place of Origin: Guangdong

Company Profile

Location: Shenzhen, Guangdong, China (Mainland)
Business Type: Manufacturer

Product Detail

Model No.: AKS-0619010
Means of Transport: Express, Ocean, Air, Land
Number of Layers: 12-Layer
Brand Name: AKS
Base Material: FR-4
Copper Thickness: 4oz
Board Thickness: 3.0mm
Min. Hole Size: 8mil
Min. Line Width: 3mil
Min. Line Spacing: 3mil
Solder Mask Color: Green
Based Materials: FR-4
MOQ: 1pcs
Payment: T/T;Paypal;Western Union;ESCROW
Price Terms: FOB SZ /EXW
Delivery Port:: Shenzhen ; HK
Shipment: UPS;DHL;FEDEX;TNT;EMS,etc.
Original: China
Delivery time: 3-15days
Warranty: 1 year
Production Capacity: 50k sqm/M
Packing: Vacuum+desiccant inside,Outer Carton
Delivery Date: 3-15days
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Product Description

Specifications
HDI pcb
Material :FR-4, 2OZ, 2.0mm
Min hole :0.2mm
Min line width/space: 0.25mm/0.25mm
HDI pcb
Material :FR-4, 2OZ, 2.0mm
Min hole :0.2mm
Min line width/space: 0.25mm/0.25mm
Surface finish: HASL Lead Free
Reference - Our Production Capability for Rigid PCB:
1) Layer: 1-30
2) Board finished thickness: 0.21mm-7.0mm
3) Material: FR-4, CEM-1,CEM-3, High TG, FR4 Halogen Free,Rogers
4) Max. finished board size: 23 × 25 ( 580mm×900mm )
5) Min. drilled hole size: 3mil (0.075mm)
6) Min. Line width: 3mil (0.075mm)
Min.Line spacing:3mil (0.075mm)
7) Surface finish/treatment : HASL / HASL lead free,HAL, Chemical tin,Chemical Gold, Immersion Silver/Gold,OSP,Gold plating
-Other Technology: Gold Finger,Peelable Mask,Non-across Blind/ Buried Vias;Characteristic impedance Control,etc
8) Copper thickness: 0.5-7.0 OZ
9) Solder mask color: green/yellow/black/white/red/blue
10) Copper thickness in hole: >25.0 um (>1mil)
11)Inner packing: Vacuum packing / Plastic bag
Outer packing: Standard carton packing
12) Shape tolerance: ±0.13
Hole tolerance: PTH: ±0.076 NPTH: ±0.05
13) Certificate: UL, ISO 9001, ISO 14001,
14) Special requirements: Buried and blind vias+controlled impedance +BGA
15) Profiling: Punching, Routing, V-CUT, Beveling
16) Provides OEM services to all sorts of printed circuit board assembly as well as electronic encased products
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