| Substrate size | M substrate (330×250mm) | ○ |
| Element size | Laser identification | 0603 chip(0201) inch chip～20mm components |
| or 26.5×11mm*1 |
| (0402(01005) |
| Portrait recognition | standard | 1.0×0.5mm～20mm components |
| option | 0.3mm ～16mm |
| Component placement accuracy*2 | Laser identification | High precision components | XY | ±20μm |
| θ | ±0.30° |
| Chip components | XY | ±40μm |
| θ | ±3.00° |
| Portrait recognition | High precision components | XY | ±20μm |
| θ | ±0.15° |
| IC components | XY | ±30μm |
| θ | ±0.30° |
| components in high-speed *2*3 | Laser identification | High precision components | 1,600CPH |
| chip | 10,000CPH |
| Portrait recognition | High precision components | 1,300CPH |
| IC components | 2,500CPH |
| Element types | 80 or more |
