FR4 Copper clad laminate is made of epoxy resin, high quality glass cloth and copper foil. It has excellent
heat resistance, good mechanical & electrical properties, high peel strength and chemical resistance,
Suitable for making flame resistant PCB of
high_grade electronic equipment, computers and other printed circuit boards that required high density and
excellent heat resistance.
Peel strength (35μm copper foil) : min 1.4 N/mm
immerse resistance288℃,20S:no change
Dielectric Voltage:≥40KV
Dielectric Constant (1MHz):≤5.4
GeneralProperties |
TestItem | Unit | Condition | TypicalValue |
FR-4CCL |
Surfaceresistivity | Afterdamp | MΩ | F | ≥104 |
Volumeresistivity | Afterdamp | MΩ.cm | F | ≥106 |
Afterheattreatment | E-24/125 | ≥103 |
DielectricVoltage | KV | D-48/50+D-0.5/23 | ≥40 |
DielectricConstant(1MHz) | | C-40/23/50 | ≤5.4 |
Peelstrength(35μmcopperfoil) | N/mm | A | ≥1.40 |
Immerseresistance | | 288℃,20S | Nodelamination Non-foaming |
| 260℃,20S | -- |
Bendingstrength | Vertical | MPa | A | ≥410 |
Parel. | A | ≥340 |
Waterabsorption | % | E-1/105+des+D-24/23 | 0.10-0.77≤0.80 |
0.78-3.20≤0.35 |
Flammability | | A&E-1/105+des | 94V-0 |