This wafer cutting machine can automatically cut the cooled wafers into pieces according to required sizes.
Technology and function
Materials: Adopt imported stainless steel; German SEW motor.
Different sizes of wafers can be cut by replacement of cutting knife.
Automatical process, can cut 16 pieces per minute.
Cutting method: Blade or steel wire type.
External dimension(L× W× H): 2m× 2m× 0.87m
Total power: 0.75KW